JPS6450446U - - Google Patents
Info
- Publication number
- JPS6450446U JPS6450446U JP14580387U JP14580387U JPS6450446U JP S6450446 U JPS6450446 U JP S6450446U JP 14580387 U JP14580387 U JP 14580387U JP 14580387 U JP14580387 U JP 14580387U JP S6450446 U JPS6450446 U JP S6450446U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- metal layer
- electronic component
- groove
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案のリード付き電子部品として半
導体素子収納用パツケージを例とした場合の断面
図、第２図は第１図のパツケージに使用される外
部リードピンの拡大斜視部、第３図は第１図にお
ける外部リードピンの取着部分の部分拡大斜視図
、第４図は従来のリード付き電子部品として半導
体素子収納用パツケージを例とした場合の断面図
である。
１……絶縁基体、１ａ……貫通孔、３……外部
リードピン、３ａ……溝部、７……接着材、Ａ…
…空隙。
Fig. 1 is a cross-sectional view of a package for housing a semiconductor element as an example of the electronic component with leads of the present invention, Fig. 2 is an enlarged perspective view of an external lead pin used in the package of Fig. 1, and Fig. 3 is a FIG. 1 is a partially enlarged perspective view of a portion where external lead pins are attached, and FIG. 4 is a cross-sectional view of a semiconductor element housing package as an example of a conventional electronic component with leads. DESCRIPTION OF SYMBOLS 1...Insulating base, 1a...Through hole, 3...External lead pin, 3a...Groove, 7...Adhesive material, A...
...Void.
Claims (1)
、該貫通孔内に先端部に溝部を有する棒状の外部
リードピンの先端を圧入すると共に溝部と貫通孔
内表面金属層との間に形成される空隙内に導電性
接着材を充填して成るリード付き電子部品におい
て、前記外部リードピンの溝部と貫通孔内表面金
属層との間に形成される空隙の断面積を貫通孔の
断面積の１３乃至４０％としたことを特徴とする
リード付き電子部品。 A metal layer is provided on the inner surface of the through hole provided in the insulating base, and the tip of a rod-shaped external lead pin having a groove at the tip is press-fitted into the through hole, and a metal layer is formed between the groove and the metal layer on the inner surface of the through hole. In a lead-equipped electronic component in which a conductive adhesive is filled in a gap, the cross-sectional area of the gap formed between the groove of the external lead pin and the metal layer on the inner surface of the through-hole is 13 times the cross-sectional area of the through-hole. An electronic component with a lead, characterized in that the leaded electronic component is 40% to 40%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14580387U JPS6450446U (en) | 1987-09-24 | 1987-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14580387U JPS6450446U (en) | 1987-09-24 | 1987-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6450446U true JPS6450446U (en) | 1989-03-29 |
Family
ID=31414712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14580387U Pending JPS6450446U (en) | 1987-09-24 | 1987-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6450446U (en) |
-
1987
- 1987-09-24 JP JP14580387U patent/JPS6450446U/ja active Pending
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