JPS6449987U - - Google Patents
Info
- Publication number
- JPS6449987U JPS6449987U JP1987143780U JP14378087U JPS6449987U JP S6449987 U JPS6449987 U JP S6449987U JP 1987143780 U JP1987143780 U JP 1987143780U JP 14378087 U JP14378087 U JP 14378087U JP S6449987 U JPS6449987 U JP S6449987U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting diode
- emitting
- angle
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 238000002834 transmittance Methods 0.000 claims 3
- 239000000463 material Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987143780U JPS6449987U (es) | 1987-09-22 | 1987-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987143780U JPS6449987U (es) | 1987-09-22 | 1987-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6449987U true JPS6449987U (es) | 1989-03-28 |
Family
ID=31410908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987143780U Pending JPS6449987U (es) | 1987-09-22 | 1987-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6449987U (es) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH033762U (es) * | 1989-06-01 | 1991-01-16 | ||
| JPH03171782A (ja) * | 1989-11-30 | 1991-07-25 | Iwasaki Electric Co Ltd | 発光ダイオード |
| US7347603B2 (en) | 2002-11-05 | 2008-03-25 | Matsushita Electric Industrial Co., Ltd. | Light-emitting diode |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50103297A (es) * | 1974-01-11 | 1975-08-15 |
-
1987
- 1987-09-22 JP JP1987143780U patent/JPS6449987U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50103297A (es) * | 1974-01-11 | 1975-08-15 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH033762U (es) * | 1989-06-01 | 1991-01-16 | ||
| JPH03171782A (ja) * | 1989-11-30 | 1991-07-25 | Iwasaki Electric Co Ltd | 発光ダイオード |
| US7347603B2 (en) | 2002-11-05 | 2008-03-25 | Matsushita Electric Industrial Co., Ltd. | Light-emitting diode |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0334354Y2 (es) | ||
| JPS6449987U (es) | ||
| JPS5974603U (ja) | 発光ダイオ−ドを有する光警告装置及び／又は光表示装置 | |
| JPH0316794B2 (es) | ||
| JPH0241662Y2 (es) | ||
| JPS6335089U (es) | ||
| JPS6234470Y2 (es) | ||
| JPS6113958U (ja) | 発光ダイオ−ドランプ | |
| JPH0385669U (es) | ||
| JPH04109556U (ja) | 反射ケース型ｌｅｄランプ | |
| JPH0514532Y2 (es) | ||
| JPS604215Y2 (ja) | 発光ダイオ−ドマトリクス表示器 | |
| JPH01167065U (es) | ||
| JPS6236312Y2 (es) | ||
| JPH0439237B2 (es) | ||
| JPH0292955U (es) | ||
| JPH0361347U (es) | ||
| JPH0428687U (es) | ||
| JPH0112303Y2 (es) | ||
| JPS63101990U (es) | ||
| JPS604224Y2 (ja) | 発光ダイオ−ド表示器 | |
| JPH0440554U (es) | ||
| JPH0742149U (ja) | 発光ダイオードランプの構造 | |
| JPH04118516U (ja) | 発光ダイオード表示灯 | |
| JPS64350U (es) |