JPS6448566U - - Google Patents
Info
- Publication number
- JPS6448566U JPS6448566U JP14156187U JP14156187U JPS6448566U JP S6448566 U JPS6448566 U JP S6448566U JP 14156187 U JP14156187 U JP 14156187U JP 14156187 U JP14156187 U JP 14156187U JP S6448566 U JPS6448566 U JP S6448566U
- Authority
- JP
- Japan
- Prior art keywords
- housing
- ventilation hole
- wall
- electronic device
- cooling structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 238000009423 ventilation Methods 0.000 claims 3
- 239000011810 insulating material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Description
第1図は本考案に係る冷却構造を採用した電子
機器の概念的な縦断面図、第2図は本考案に係る
冷却構造の他の実施例を示した電子機器の概念的
な縦断面図である。
1……筐体、3b……前面側側壁、5……回路
基板、5a……電子部品、9……排気口、10…
…吸気口(通気孔)、11……メイン回路基板、
11a……電子部品、A……段状壁、A1……中
間底壁部、A2……側壁部、21……筐体、22
c……後面側側壁、23b……前面側側壁、23
c……後面側側壁、25……回路基板、25a…
…電子部品、29……回路基板、29a……電子
部品、30……吸気口(通気孔)、31……排気
口、32……フアン、33……放熱板、33a…
…フイン、33b……延長部、34……断熱材、
B……段状壁、B1……中間底壁部、B2……側
壁部。
FIG. 1 is a conceptual vertical cross-sectional view of an electronic device that employs the cooling structure according to the present invention, and FIG. 2 is a conceptual vertical cross-sectional view of an electronic device showing another embodiment of the cooling structure according to the present invention. It is. DESCRIPTION OF SYMBOLS 1... Housing, 3b... Front side wall, 5... Circuit board, 5a... Electronic component, 9... Exhaust port, 10...
...Intake port (vent), 11...Main circuit board,
11a...Electronic component, A...Stepped wall, A1 ...Intermediate bottom wall portion, A2 ...Side wall portion, 21...Housing, 22
c...Rear side wall, 23b...Front side side wall, 23
c...Rear side wall, 25...Circuit board, 25a...
...Electronic component, 29...Circuit board, 29a...Electronic component, 30...Intake port (vent), 31...Exhaust port, 32...Fan, 33...Radiation plate, 33a...
...Fin, 33b...Extension part, 34...Insulating material,
B...Stepped wall, B1 ...Intermediate bottom wall portion, B2 ...Side wall portion.
Claims (1)
れた外気によつて、筐体内の電子部品を冷却する
電子機器の冷却構造において、前記筐体の側壁下
部に内方へ向けて屈曲する段状壁を形成し、該段
状壁に前記通気孔を形成したことを特徴とする電
子機器の冷却構造。 In a cooling structure for an electronic device in which a ventilation hole is formed in the wall of the housing and electronic components inside the housing are cooled by outside air taken in through the ventilation hole, the lower part of the side wall of the housing is bent inward. 1. A cooling structure for an electronic device, characterized in that a stepped wall is formed, and the ventilation hole is formed in the stepped wall.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14156187U JPS6448566U (en) | 1987-09-18 | 1987-09-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14156187U JPS6448566U (en) | 1987-09-18 | 1987-09-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6448566U true JPS6448566U (en) | 1989-03-24 |
Family
ID=31406733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14156187U Pending JPS6448566U (en) | 1987-09-18 | 1987-09-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6448566U (en) |
-
1987
- 1987-09-18 JP JP14156187U patent/JPS6448566U/ja active Pending
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