JPS6441194U - - Google Patents
Info
- Publication number
- JPS6441194U JPS6441194U JP13663587U JP13663587U JPS6441194U JP S6441194 U JPS6441194 U JP S6441194U JP 13663587 U JP13663587 U JP 13663587U JP 13663587 U JP13663587 U JP 13663587U JP S6441194 U JPS6441194 U JP S6441194U
- Authority
- JP
- Japan
- Prior art keywords
- connectors
- optional
- electronic circuit
- module
- circuit package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009423 ventilation Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Connector Housings Or Holding Contact Members (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例の電子回路パツケー
ジ構造を示す斜視図、第２図はダミーモジユール
の縦断面図、第３図は第１図の実施例の電子回路
パツケージを用いた電子装置筐体内の風の流れを
示す図、第４図は従来の電子回路パツケージ構造
を示す第１図相当の斜視図、第５図は電子回路パ
ツケージを用いた電子装置筐体を示す斜視図、第
６図は従来の電子回路パツケージを用いた電子装
置筐体内の風の流れを示す第４図相当の図である
。
１，２０：電子回路パツケージ、２：プリント
板、５：オプシヨンモジユール、６：コネクタ、
９：筐体、１０：フアン、２１：ダミーモジユー
ル、２２：カバー、２３：ダミープレート、２４
：突起。
FIG. 1 is a perspective view showing the structure of an electronic circuit package according to an embodiment of the present invention, FIG. 2 is a vertical cross-sectional view of a dummy module, and FIG. 4 is a perspective view equivalent to FIG. 1 showing a conventional electronic circuit package structure; FIG. 5 is a perspective view showing an electronic device casing using an electronic circuit package; FIG. 6 is a diagram corresponding to FIG. 4 showing the flow of air inside an electronic device housing using a conventional electronic circuit package. 1, 20: Electronic circuit package, 2: Printed board, 5: Option module, 6: Connector,
9: Housing, 10: Fan, 21: Dummy module, 22: Cover, 23: Dummy plate, 24
:protrusion.
Claims (1)
クタに必要に応じてオプシヨンモジユールを実装
してなる電子回路パツケージ構造において、前記
オプシヨンモジユールを実装しない前記コネクタ
すべてに、該コネクタに被せるカバーの上面に前
記オプシヨンモジユールと近似の形状または等価
の通風抵抗を有する平板を直立させて形成したダ
ミーモジユールを脱着可能に被せたことを特徴と
する電子回路パツケージ構造。 In an electronic circuit package structure comprising a large number of connectors on a printed board and optional modules mounted on the connectors as required, the upper surface of a cover to be placed over all the connectors that do not have the optional modules mounted thereon. An electronic circuit package structure characterized in that a dummy module, which is formed by standing upright a flat plate having a shape similar to that of the optional module or having an equivalent ventilation resistance, is removably covered over the optional module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13663587U JPS6441194U (en) | 1987-09-07 | 1987-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13663587U JPS6441194U (en) | 1987-09-07 | 1987-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6441194U true JPS6441194U (en) | 1989-03-13 |
Family
ID=31397326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13663587U Pending JPS6441194U (en) | 1987-09-07 | 1987-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6441194U (en) |
-
1987
- 1987-09-07 JP JP13663587U patent/JPS6441194U/ja active Pending
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