JPS63155694U

JPS63155694U -

Info

Publication number: JPS63155694U
Application number: JP4912687U
Authority: JP
Priority date: 1987-03-31
Filing date: 1987-03-31
Publication date: 1988-10-12

Description

[Brief explanation of the drawing]

第１図は本考案の一実施例の電子機器用筐体の
放熱構造を示す断面図、第２図はその電子機器用
筐体の外観を示す斜視図、第３図は従来の電子機
器用筐体を示す斜視図、第４図はその電子機器用
筐体の内部構造を示す断面図である。１，２５……電子機器用筐体、２……把つ手、
３……側面部、４……プリント基板、５……隔壁
、６，２３……発熱量の多い電子部品、７，２１
……吸気口、８，２２……排気口、９……空気の
流れ、１０……仕切板、１１……発熱量の少ない
電子部品、１２……上面部、１３……底面部、１
４……上部案内板、１５……下部案内板、１６…
…接続部、２０……電子部品。 Fig. 1 is a sectional view showing the heat dissipation structure of an electronic device casing according to an embodiment of the present invention, Fig. 2 is a perspective view showing the appearance of the electronic device casing, and Fig. 3 is a conventional electronic device casing. FIG. 4 is a perspective view showing the casing, and FIG. 4 is a sectional view showing the internal structure of the casing for electronic equipment. 1, 25... Housing for electronic equipment, 2... Gripping hand,
3... Side part, 4... Printed circuit board, 5... Partition wall, 6, 23... Electronic component that generates a large amount of heat, 7, 21
... Intake port, 8, 22 ... Exhaust port, 9 ... Air flow, 10 ... Partition plate, 11 ... Electronic component with low calorific value, 12 ... Top surface part, 13 ... Bottom surface part, 1
4... Upper guide plate, 15... Lower guide plate, 16...
...Connection part, 20...Electronic component.

Claims

[Scope of utility model registration request]

In a case in which a plurality of printed circuit boards are installed at predetermined intervals at right angles to the bottom surface, electronic components with low heat generation mounted on each of the printed circuit boards and the non-connection side end of each of the printed circuit boards are concentrated. A partition wall is provided between each of the printed circuit boards to separate them from the electronic components that generate a large amount of heat to be mounted, and an air intake port is provided on the bottom of the casing to take in cold air from the outside into the electronic components that generate a large amount of heat. An exhaust port for discharging internal warm air to the outside is provided on the side surface of the housing, and a partition is provided between the side surface of the housing and the end of the non-connected part of each printed circuit board. an upper guide plate that guides air to the exhaust port is provided between each partition plate, and a lower guide plate that guides the air taken in from the intake port toward the electronic component that generates a large amount of heat. is provided between the intake port and each of the printed circuit boards, and the tip of the upper guide plate and the end of the partition wall on the exhaust port side are close to each other. Heat dissipation structure.