JPS6447900A - Solution and method for removing nickel-phosphorus alloy plating layer - Google Patents
Solution and method for removing nickel-phosphorus alloy plating layerInfo
- Publication number
- JPS6447900A JPS6447900A JP20288087A JP20288087A JPS6447900A JP S6447900 A JPS6447900 A JP S6447900A JP 20288087 A JP20288087 A JP 20288087A JP 20288087 A JP20288087 A JP 20288087A JP S6447900 A JPS6447900 A JP S6447900A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- alloy plating
- plating film
- electric potential
- value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- ing And Chemical Polishing (AREA)
Abstract
PURPOSE:To easily remove an Ni-P alloy plating film from a plated Cu or Cu alloy member without damaging the Cu or Cu alloy substrate by immersing the member in a removing soln. having a specified compsn. and by carrying out anodic electrolysis at a specified electric potential. CONSTITUTION:When an Ni-P alloy plating film having superior corrosion, wear and heat resistances is removed from a plated Cu or Cu alloy member having a complex shape, the member is immersed in a removing soln. contg. 50-70wt.% sulfuric acid and 1-15g/l at least one kind of chloroacetic acid such as mono-, di- or trichloroacetic acid. The electric potential of the Cu or Cu alloy member having the Ni-P alloy plating film to the removing soln. is measured and anodic electrolysis is carried out while regulating the electric potential to above a value at which the Ni-P alloy is eluted and below a value at which the Cu or Cu alloy is dissolved or a value at which the Cu or Cu alloy is passivated and hardly causes dissolution. Thus, only the Ni-P alloy plating film is easily removed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20288087A JPS6447900A (en) | 1987-08-14 | 1987-08-14 | Solution and method for removing nickel-phosphorus alloy plating layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20288087A JPS6447900A (en) | 1987-08-14 | 1987-08-14 | Solution and method for removing nickel-phosphorus alloy plating layer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6447900A true JPS6447900A (en) | 1989-02-22 |
JPH0520520B2 JPH0520520B2 (en) | 1993-03-19 |
Family
ID=16464731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20288087A Granted JPS6447900A (en) | 1987-08-14 | 1987-08-14 | Solution and method for removing nickel-phosphorus alloy plating layer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6447900A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010285637A (en) * | 2009-06-10 | 2010-12-24 | Mitsubishi Shindoh Co Ltd | Method for recycling nickel-plated copper or copper alloy scrap |
JP2011084756A (en) * | 2009-10-13 | 2011-04-28 | Mitsubishi Shindoh Co Ltd | Method for recycling copper or copper alloy waste to which nickel-plating is applied |
-
1987
- 1987-08-14 JP JP20288087A patent/JPS6447900A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010285637A (en) * | 2009-06-10 | 2010-12-24 | Mitsubishi Shindoh Co Ltd | Method for recycling nickel-plated copper or copper alloy scrap |
JP2011084756A (en) * | 2009-10-13 | 2011-04-28 | Mitsubishi Shindoh Co Ltd | Method for recycling copper or copper alloy waste to which nickel-plating is applied |
Also Published As
Publication number | Publication date |
---|---|
JPH0520520B2 (en) | 1993-03-19 |
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