JPS6446919A - Sealing mechanism of heat-resistant tube for heating wafer - Google Patents

Sealing mechanism of heat-resistant tube for heating wafer

Info

Publication number
JPS6446919A
JPS6446919A JP20370687A JP20370687A JPS6446919A JP S6446919 A JPS6446919 A JP S6446919A JP 20370687 A JP20370687 A JP 20370687A JP 20370687 A JP20370687 A JP 20370687A JP S6446919 A JPS6446919 A JP S6446919A
Authority
JP
Japan
Prior art keywords
cover body
discharge port
heat
airtightness
resistant tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20370687A
Other languages
Japanese (ja)
Inventor
Akiyuki Furuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP20370687A priority Critical patent/JPS6446919A/en
Publication of JPS6446919A publication Critical patent/JPS6446919A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To ensure the airtightness of a heat-resistant tube and a cover body using a simple structure while automating the cover body by introducing a gas remaining among a fitting work surface in a ring-shaped member and a reaction tube, the cover body, etc., without being discharged through an exclusive discharge port to the outside through a specified discharge port from an annular groove. CONSTITUTION:Gases respectively remaining among a fitting working surface in a ring-shaped member 22 and a fitting working surface in a tapered section 21a in a reaction tube 21 and a cover body 26 without being discharged to the outside through a third discharge port 29 can be introduced to the outside through a first discharge port 25 communicated with a first groove 23 and a second discharge port 28 communicated with a second groove 27. Consequently, airtightness on the fitting work surfaces can be held sufficiently. A discharge port for exhausting the gas as seen in conventional devices is not connected to the cover body 26, thus automatically opening and closing the cover body 26 easily. Accordingly, the airtightness of a heat-resistant tube and the cover body can be ensured by simple structure while easily automating the cover body.
JP20370687A 1987-08-17 1987-08-17 Sealing mechanism of heat-resistant tube for heating wafer Pending JPS6446919A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20370687A JPS6446919A (en) 1987-08-17 1987-08-17 Sealing mechanism of heat-resistant tube for heating wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20370687A JPS6446919A (en) 1987-08-17 1987-08-17 Sealing mechanism of heat-resistant tube for heating wafer

Publications (1)

Publication Number Publication Date
JPS6446919A true JPS6446919A (en) 1989-02-21

Family

ID=16478505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20370687A Pending JPS6446919A (en) 1987-08-17 1987-08-17 Sealing mechanism of heat-resistant tube for heating wafer

Country Status (1)

Country Link
JP (1) JPS6446919A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06326047A (en) * 1994-05-30 1994-11-25 Kokusai Electric Co Ltd Joining section structure of reactant gas feed pipe and reaction pipe of diffusion equipment

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6271220A (en) * 1985-09-25 1987-04-01 Toshiba Corp Sealing method for semiconductor diffusing apparatus
JPS6431411A (en) * 1987-07-28 1989-02-01 Toshiba Corp Device for closing tube opening of heat treatment furnace

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6271220A (en) * 1985-09-25 1987-04-01 Toshiba Corp Sealing method for semiconductor diffusing apparatus
JPS6431411A (en) * 1987-07-28 1989-02-01 Toshiba Corp Device for closing tube opening of heat treatment furnace

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06326047A (en) * 1994-05-30 1994-11-25 Kokusai Electric Co Ltd Joining section structure of reactant gas feed pipe and reaction pipe of diffusion equipment

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