JPS644675B2 - - Google Patents

Description

[Detailed Description of the Invention] [Summary] This invention relates to a hot air nozzle unit that is a device for automatically removing flat-lead type electronic components to be removed from a printed circuit board, and is compatible with different types of electronic components. The purpose is to allow various types of hot air nozzle units to be easily attached to and detached from the work head of an automatic electronic component removal device in one operation, and to prevent deformation of the sleeve nozzle. A hot air nozzle unit of an automatic removal device for removing the workpiece, wherein one side has a joint surface that comes into close contact with the lower surface of the work head of the automatic removal device, and the other side has means for engaging and positioning a receiving plate provided on the work head. A through-hole for the insertion of a vacuum suction nozzle for suctioning electronic components was formed in the center of the joint surface, and an annular hot air distribution groove facing the cavity of the work head was arranged around the through-hole. A standard base, a plurality of sleeve nozzles that correspond to the flat leads of the electronic components and communicate with the hot air distribution grooves of the standard base, and a plurality of sleeve nozzles that are planted on the standard base so as to protrude by a certain distance from the tips of the sleeve nozzles. The sleeve nozzle includes at least one pair of stopper pins provided therein, and a reinforcing member that is fixed to the sleeve nozzle and holds the sleeve nozzle in parallel.

[Industrial application field]

The present invention relates to equipment for manufacturing printed board packages, and more particularly to a hot air nozzle unit for an apparatus for automatically removing flat-lead electronic components to be removed from a printed circuit board.

Recently, printed circuit board packages (hereinafter referred to as printed boards) installed in electronic devices have been developed by soldering the flat leads of electronic components to the foot patterns formed on the printed circuit board in order to surface-mount various electronic components at high density. Since it is often necessary to select and replace any mounted electronic component during debugging or maintenance inspection of printed boards using this surface mount method, it is possible to immediately respond to electronic components of various sizes. There is a need for a structure of a hot air nozzle unit for an automatic electronic component removal device that can perform the following steps.

[Conventional technology]

The hot air nozzle unit of an automatic electronic component removal device that has been widely used in the past has a square plate with a joint surface on one side that comes into close contact with the lower surface of a work head that moves up and down, and a joint surface that faces the annular cavity of the work head. Heat resistant with an annular hot air distribution groove, a through hole in the center for inserting a vacuum suction nozzle that protrudes from the bottom surface of the work head and sucks the back side of electronic components, and holes for tightening to the work head at the four corners. A base made of wood is formed, and on the other side of the base, multiple sleeve nozzles that spray hot air are planted at each pitch so as to face the flat leads placed on electronic components of various sizes. are doing.

Then, by means of a control device that continuously controls a pre-programmed predetermined sequence, a means for moving the electronic components mounted on the printed board to a predetermined position, such as an X-Y table and a device orthogonal to the X-Y table, is used. A vacuum suction nozzle of an automatic removal device equipped with a means for arbitrarily moving up and down the electronic component protruding from the lower surface of the work head and connected to means for detecting the suction state of the electronic component is inserted into the through hole of the base to remove the bonding surface. The hot air nozzle unit is tightly attached to the underside of the work head, and the hot air nozzle unit is fixed to the work head with bolts or the like.

The operation of the automatic electronic component removal device with the above configuration is as follows:
The work head is lowered and the suction nozzle is brought into pressure contact with the back surface of the electronic component positioned on the X-Y table to suction it, and hot air at a predetermined temperature is ejected from the sleeve nozzle of the hot air nozzle unit onto the upper surface of the flat lead for a certain period of time. After that, the work head is raised by an inch, and the sensor detects whether it rises with the electronic component being sucked. If the electronic component is detected to be sucked, the control device moves the next electronic component to a predetermined position. position, and if it is detected that the electronic component is not attracted, the inching operation is repeated until a predetermined time limit.

[Problem to be solved by the invention]

The problem with the conventional hot air nozzle unit described above is that the printed circuit board has many different types of electronic components mounted on it, and in order to selectively remove the electronic components, multiple types of electronic components must be selected, each corresponding to the size of the electronic component. A hot air nozzle unit is required. For this reason, we are sequentially replacing multiple types of hot air nozzle units on the electronic component automatic removal device.
There are problems in that it takes a lot of time to attach and detach the hot air nozzle unit, reducing the operating rate of the device, and that the sleeve nozzle with a small diameter easily deforms.

In view of the above-mentioned problems, the present invention provides a system that allows various hot air nozzle units compatible with different types of electronic components to be easily attached and detached from the work head of an automatic electronic component removal device in one operation, and prevents deformation of the sleeve nozzle. The purpose of the present invention is to provide a hot air nozzle unit for an automatic electronic component removal device that is capable of removing electronic components.

[Means to solve the problem]

As shown in FIGS. 1 to 4, the present invention provides a joint surface 3a that is in close contact with the lower surface 1a of the work head 1 on one side, and a seat for the holder 11 hinged to the lower surface 1a of the work head 1 on the other side. means for engaging and positioning 11a, such as a constant angle taper 3b;
The bonding surface 3a has a through hole 3 through which a vacuum suction nozzle 14 for sucking the electronic component 21 is inserted.
1 is bored in the center, and an annular hot air distribution groove 33 is formed around the through hole 31 so as to face the cavity 1b of the work head 1. The flat lead 21 of the electronic component 21 is installed on the bottom surface of the standard base 3.
a, and has a plurality of sleeve nozzles 6 of fine diameter made of metal that are penetrated to the hot air distribution groove 33, and has a length protruding by a certain distance from the tip of the sleeve nozzle 6, and the boss portion 2 At least one pair of stopper pins 7 implanted symmetrically on the lower surface and a slit groove 81 that holds the implanted sleeve nozzle 6 in parallel are formed, and reinforcement made of a heat-resistant material prevents deformation of the sleeve nozzle 6 during operation. It is composed of member 8.

[Effect]

In the present invention, a plurality of sleeve nozzles 6 that face the flat lead 21a of the electronic component 21 and communicate with the hot air distribution groove 33 are provided on the standard base 3 which has a standardized taper 3b of a constant angle formed at the lower part of the outer periphery. , a pair of stopper pins 7 are implanted on the lower surface of the outside of the sleeve nozzle 6, and a reinforcing member 8 is welded to the sleeve nozzle 6 to hold it in parallel, preventing deformation during operation. The hot air jetted from the hot air nozzle advances straight to the flat lead 21a and efficiently melts the joining solder, and the locking mechanism 13 locks the receiver 11 provided with the seat 11a that fits into the taper 3b formed at the lower part of the outer periphery. The unit can be easily attached and detached in one operation, making it possible to improve the operating rate of the device.

〔Example〕

Embodiments of the present invention will be described below with reference to FIGS. 1 to 4.

1, 2, and 3 are a plan view, a sectional side view, and a bottom view of the sleeve-type hot air nozzle unit of the present invention, and FIG. 4 is a perspective view of a reinforcing member for the sleeve nozzle. 3 is a standard base formed so that it can be attached and detached in one motion to an automatic electronic component removal device; 6 is a sleeve nozzle that injects hot air to the flat lead of the electronic component; and 7 is a stopper pin that maintains a constant distance between the tip of the sleeve nozzle and the flat lead. , 8 is a reinforcing member of the sleeve nozzle.

As shown in FIG. 3, the standard base 3 has a joint surface 3a that is in close contact with the lower surface 1a of the work head 1 that moves up and down.
is provided on one side of the disk, and on the other side is formed a taper 3b of a constant angle that engages with the seat 11a of the receiving plate 11 hinged to the lower surface 1a of the work head 1. A through hole 31 is formed in the joint surface 3a, through which a vacuum suction nozzle 14 that protrudes from the lower surface 1a of the work head 1 and suctions the back surface of the electronic component 21 is inserted, as indicated by a dotted line in the center. This member is attached to the work head 1 and has an annular hot air distribution groove 33 that is open on the joint surface 3a side so as to face the cavity 1b that communicates with the hot air generator of the work head 1.

The sleeve nozzle 6 is a metal pipe with a fine diameter that injects hot air onto the flat lead 21a of the electronic component 21.

The stopper pin 7 is a metal rod formed to a length that provides a predetermined distance between the tip of the sleeve nozzle 6 and the flat lead 21a.

The reinforcing member 8 has slit grooves 81 that can be engaged with the rows of sleeve nozzles 6, as shown in the perspective view of FIG.
are arranged in parallel.

The structure of the hot air nozzle unit using the above-mentioned members is as shown in FIG. It is seated on a concave seat 32, and a fine-diameter sleeve nozzle 6 is connected to the hot air distribution groove 33 on the lower surface of the standard base 3 so as to face each flat lead 21a of the electronic component 21 soldered to the printed board 2. At the same time, a pair of stopper pins 7 are planted symmetrically outside the sleeve nozzle 6 area. Further, in order to prevent the sleeve nozzle 6, which is minute and weak, from being bent, the slit groove 81 of the reinforcing member 8 is engaged from the outside of the sleeve nozzle 6, and the sleeve nozzle 6 is fixed by, for example, brazing.

The hot air nozzle unit having the above structure has a taper 3 formed at the lower part of the standard base 3 on the seat 11a of the receiver 11 hinged to the work head 1 with a fulcrum pin 12.
The vacuum suction nozzle 14 is attached to the standard base 3 by inserting and positioning the part b and activating the locking mechanism 13 to bring the joint surface 3a of the standard base 3 into close contact with the lower surface 1a of the work head 1. The hot air distribution groove 33 passes through the center and communicates with the cavity 1b, and hot air is injected from the sleeve nozzle 6 to each flat lead 21a of the electronic component 21.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, the hot air nozzle unit, which can be immediately adapted to different electronic components, can be easily attached and detached with an extremely simple configuration, and the operating rate of the automatic electronic component removal device can be improved. It is possible to provide a structure of a hot air nozzle unit for an automatic electronic component removal device, which has advantages such as being able to prevent deformation of the sleeve nozzle, and can be expected to significantly improve economy and reliability.

[Brief explanation of drawings]

1, 2, and 3 are a plan view, a side sectional view, and a bottom view showing a multi-sleeve type hot air nozzle unit according to an embodiment of the present invention, and FIG. 4 is a perspective view showing a reinforcing member of the sleeve nozzle. It is. In the figure, 1 is a work head, 2 is a printed board package, 3 is a standard base, 4 is an air strainer, 5 is a holding plate, 6 is a sleeve nozzle, 7 is a stopper pin, and 8 is a reinforcing member.

Claims (1)

[Scope of Claims] 1. A hot air nozzle unit for an automatic removal device for removing any electronic component mounted on a printed circuit board package, wherein one side is provided with a bonding surface 3a that comes into close contact with the lower surface of the work head 1 of the automatic removal device. A means 3b for engaging and positioning the receiving plate 11 provided on the work head 1 is formed on the other side, and a vacuum suction nozzle 1 for suctioning the electronic component 21 at the center is formed on the joint surface 3a.
4 through-holes 31 are bored, and the through-holes 31
A standard base 3 is provided with an annular hot air distribution groove 33 facing the cavity 1b of the work head 1 around the standard base 3, and the hot air distribution groove 33 of the standard base 3 corresponds to the flat lead 21a of the electronic component 21. a plurality of sleeve nozzles 6 communicating with the sleeve nozzles 6; at least one pair of stopper pins 7 implanted in the standard base 3 so as to protrude by a certain distance from the tips of the sleeve nozzles 6; A structure of a hot air nozzle unit for an automatic electronic component removal device, characterized in that it is composed of a reinforcing member 8 that holds a sleeve nozzle 6 in parallel.