JPS6444637U - - Google Patents
Info
- Publication number
- JPS6444637U JPS6444637U JP1987138838U JP13883887U JPS6444637U JP S6444637 U JPS6444637 U JP S6444637U JP 1987138838 U JP1987138838 U JP 1987138838U JP 13883887 U JP13883887 U JP 13883887U JP S6444637 U JPS6444637 U JP S6444637U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- protrusion
- sealing frame
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H57/00—General details of gearing
- F16H57/04—Features relating to lubrication or cooling or heating
- F16H57/0467—Elements of gearings to be lubricated, cooled or heated
- F16H57/0479—Gears or bearings on planet carriers
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987138838U JPH0452997Y2 (https=) | 1987-09-12 | 1987-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987138838U JPH0452997Y2 (https=) | 1987-09-12 | 1987-09-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6444637U true JPS6444637U (https=) | 1989-03-16 |
| JPH0452997Y2 JPH0452997Y2 (https=) | 1992-12-14 |
Family
ID=31401547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987138838U Expired JPH0452997Y2 (https=) | 1987-09-12 | 1987-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0452997Y2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6339191B1 (en) * | 1994-03-11 | 2002-01-15 | Silicon Bandwidth Inc. | Prefabricated semiconductor chip carrier |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6236541U (https=) * | 1985-08-20 | 1987-03-04 |
-
1987
- 1987-09-12 JP JP1987138838U patent/JPH0452997Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6236541U (https=) * | 1985-08-20 | 1987-03-04 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0452997Y2 (https=) | 1992-12-14 |
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