JPS6444637U - - Google Patents

Info

Publication number
JPS6444637U
JPS6444637U JP1987138838U JP13883887U JPS6444637U JP S6444637 U JPS6444637 U JP S6444637U JP 1987138838 U JP1987138838 U JP 1987138838U JP 13883887 U JP13883887 U JP 13883887U JP S6444637 U JPS6444637 U JP S6444637U
Authority
JP
Japan
Prior art keywords
hole
protrusion
sealing frame
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987138838U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0452997Y2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987138838U priority Critical patent/JPH0452997Y2/ja
Publication of JPS6444637U publication Critical patent/JPS6444637U/ja
Application granted granted Critical
Publication of JPH0452997Y2 publication Critical patent/JPH0452997Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987138838U 1987-09-12 1987-09-12 Expired JPH0452997Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987138838U JPH0452997Y2 (enrdf_load_html_response) 1987-09-12 1987-09-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987138838U JPH0452997Y2 (enrdf_load_html_response) 1987-09-12 1987-09-12

Publications (2)

Publication Number Publication Date
JPS6444637U true JPS6444637U (enrdf_load_html_response) 1989-03-16
JPH0452997Y2 JPH0452997Y2 (enrdf_load_html_response) 1992-12-14

Family

ID=31401547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987138838U Expired JPH0452997Y2 (enrdf_load_html_response) 1987-09-12 1987-09-12

Country Status (1)

Country Link
JP (1) JPH0452997Y2 (enrdf_load_html_response)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6339191B1 (en) * 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6236541U (enrdf_load_html_response) * 1985-08-20 1987-03-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6236541U (enrdf_load_html_response) * 1985-08-20 1987-03-04

Also Published As

Publication number Publication date
JPH0452997Y2 (enrdf_load_html_response) 1992-12-14

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