JPS6444295A - Laser beam trimming device - Google Patents

Laser beam trimming device

Info

Publication number
JPS6444295A
JPS6444295A JP62201112A JP20111287A JPS6444295A JP S6444295 A JPS6444295 A JP S6444295A JP 62201112 A JP62201112 A JP 62201112A JP 20111287 A JP20111287 A JP 20111287A JP S6444295 A JPS6444295 A JP S6444295A
Authority
JP
Japan
Prior art keywords
slit
shape
laser beam
laser light
fuse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62201112A
Other languages
Japanese (ja)
Other versions
JPH0736959B2 (en
Inventor
Naoto Sakagami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62201112A priority Critical patent/JPH0736959B2/en
Publication of JPS6444295A publication Critical patent/JPS6444295A/en
Publication of JPH0736959B2 publication Critical patent/JPH0736959B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To change the shape of laser light to the shapes respectively optimum for fuses in X- and Y-directions at a high speed by providing a laser beam oscillator, an attenuator which can attenuate the energy of the laser light as desired and a variable slit which can be changed in the opening shape at a high speed. CONSTITUTION:The laser light 15 outputted from the laser beam oscillator 1 is adjusted to the energy adequate for processing by the attenuator 2 and is projected to the variable slit 16. The laser light past the aperture of the variable slit 16 is imaged by an imaging lens 4 as the image of the slit 16 onto a wafer 8 to processed. The aperture 17 shape of the slit 16 is selected by a controller 7 to shape adequate for fuse blowing in accordance with the information on the fuse direction of a laser beam trimming device. The blown fuse of the wafer 8 is successively positioned at the imaging position of the lens 4 in accordance with the processing information of the controller 7, by which the shape of the aperture 17 of the slit 16 is changed in accordance with the direction of the fuse.
JP62201112A 1987-08-12 1987-08-12 Laser trimming device Expired - Lifetime JPH0736959B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62201112A JPH0736959B2 (en) 1987-08-12 1987-08-12 Laser trimming device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62201112A JPH0736959B2 (en) 1987-08-12 1987-08-12 Laser trimming device

Publications (2)

Publication Number Publication Date
JPS6444295A true JPS6444295A (en) 1989-02-16
JPH0736959B2 JPH0736959B2 (en) 1995-04-26

Family

ID=16435600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62201112A Expired - Lifetime JPH0736959B2 (en) 1987-08-12 1987-08-12 Laser trimming device

Country Status (1)

Country Link
JP (1) JPH0736959B2 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03237738A (en) * 1990-02-14 1991-10-23 Matsushita Electron Corp Method and apparatus for analyzing semiconductor device
US5097714A (en) * 1989-09-11 1992-03-24 Kayaba Industry Co., Ltd. Steering torque detecting apparatus
US5247883A (en) * 1990-07-09 1993-09-28 Sony Corporation Apparatus for making a printing plate and a printing plate thereof
JP2006239743A (en) * 2005-03-03 2006-09-14 V Technology Co Ltd Laser beam machining method
US7435927B2 (en) 2004-06-18 2008-10-14 Electron Scientific Industries, Inc. Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset
KR100940591B1 (en) * 2007-10-05 2010-02-05 (주)미래컴퍼니 Precision manufacturing system and method using laser beam
US7923306B2 (en) 2004-06-18 2011-04-12 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots
US7935941B2 (en) 2004-06-18 2011-05-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures
US8148211B2 (en) 2004-06-18 2012-04-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously
US8193468B2 (en) 2001-03-29 2012-06-05 Gsi Group Corporation Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure
US8238007B2 (en) 2001-02-16 2012-08-07 Electro Scientific Industries, Inc. On-the-fly laser beam path error correction for specimen target location processing
US8383982B2 (en) 2004-06-18 2013-02-26 Electro Scientific Industries, Inc. Methods and systems for semiconductor structure processing using multiple laser beam spots
US8497450B2 (en) 2001-02-16 2013-07-30 Electro Scientific Industries, Inc. On-the fly laser beam path dithering for enhancing throughput

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6232674A (en) * 1985-08-03 1987-02-12 Nippon Kogaku Kk <Nikon> Laser-light attenuating apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6232674A (en) * 1985-08-03 1987-02-12 Nippon Kogaku Kk <Nikon> Laser-light attenuating apparatus

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5097714A (en) * 1989-09-11 1992-03-24 Kayaba Industry Co., Ltd. Steering torque detecting apparatus
JPH03237738A (en) * 1990-02-14 1991-10-23 Matsushita Electron Corp Method and apparatus for analyzing semiconductor device
US5247883A (en) * 1990-07-09 1993-09-28 Sony Corporation Apparatus for making a printing plate and a printing plate thereof
US8497450B2 (en) 2001-02-16 2013-07-30 Electro Scientific Industries, Inc. On-the fly laser beam path dithering for enhancing throughput
US8238007B2 (en) 2001-02-16 2012-08-07 Electro Scientific Industries, Inc. On-the-fly laser beam path error correction for specimen target location processing
US8193468B2 (en) 2001-03-29 2012-06-05 Gsi Group Corporation Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure
US7923306B2 (en) 2004-06-18 2011-04-12 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots
US7935941B2 (en) 2004-06-18 2011-05-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures
US8148211B2 (en) 2004-06-18 2012-04-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously
US7435927B2 (en) 2004-06-18 2008-10-14 Electron Scientific Industries, Inc. Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset
US8383982B2 (en) 2004-06-18 2013-02-26 Electro Scientific Industries, Inc. Methods and systems for semiconductor structure processing using multiple laser beam spots
JP2006239743A (en) * 2005-03-03 2006-09-14 V Technology Co Ltd Laser beam machining method
KR100940591B1 (en) * 2007-10-05 2010-02-05 (주)미래컴퍼니 Precision manufacturing system and method using laser beam

Also Published As

Publication number Publication date
JPH0736959B2 (en) 1995-04-26

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