JPS6444295A - Laser beam trimming device - Google Patents
Laser beam trimming deviceInfo
- Publication number
- JPS6444295A JPS6444295A JP62201112A JP20111287A JPS6444295A JP S6444295 A JPS6444295 A JP S6444295A JP 62201112 A JP62201112 A JP 62201112A JP 20111287 A JP20111287 A JP 20111287A JP S6444295 A JPS6444295 A JP S6444295A
- Authority
- JP
- Japan
- Prior art keywords
- slit
- shape
- laser beam
- laser light
- fuse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:To change the shape of laser light to the shapes respectively optimum for fuses in X- and Y-directions at a high speed by providing a laser beam oscillator, an attenuator which can attenuate the energy of the laser light as desired and a variable slit which can be changed in the opening shape at a high speed. CONSTITUTION:The laser light 15 outputted from the laser beam oscillator 1 is adjusted to the energy adequate for processing by the attenuator 2 and is projected to the variable slit 16. The laser light past the aperture of the variable slit 16 is imaged by an imaging lens 4 as the image of the slit 16 onto a wafer 8 to processed. The aperture 17 shape of the slit 16 is selected by a controller 7 to shape adequate for fuse blowing in accordance with the information on the fuse direction of a laser beam trimming device. The blown fuse of the wafer 8 is successively positioned at the imaging position of the lens 4 in accordance with the processing information of the controller 7, by which the shape of the aperture 17 of the slit 16 is changed in accordance with the direction of the fuse.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62201112A JPH0736959B2 (en) | 1987-08-12 | 1987-08-12 | Laser trimming device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62201112A JPH0736959B2 (en) | 1987-08-12 | 1987-08-12 | Laser trimming device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6444295A true JPS6444295A (en) | 1989-02-16 |
JPH0736959B2 JPH0736959B2 (en) | 1995-04-26 |
Family
ID=16435600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62201112A Expired - Lifetime JPH0736959B2 (en) | 1987-08-12 | 1987-08-12 | Laser trimming device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0736959B2 (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03237738A (en) * | 1990-02-14 | 1991-10-23 | Matsushita Electron Corp | Method and apparatus for analyzing semiconductor device |
US5097714A (en) * | 1989-09-11 | 1992-03-24 | Kayaba Industry Co., Ltd. | Steering torque detecting apparatus |
US5247883A (en) * | 1990-07-09 | 1993-09-28 | Sony Corporation | Apparatus for making a printing plate and a printing plate thereof |
JP2006239743A (en) * | 2005-03-03 | 2006-09-14 | V Technology Co Ltd | Laser beam machining method |
US7435927B2 (en) | 2004-06-18 | 2008-10-14 | Electron Scientific Industries, Inc. | Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset |
KR100940591B1 (en) * | 2007-10-05 | 2010-02-05 | (주)미래컴퍼니 | Precision manufacturing system and method using laser beam |
US7923306B2 (en) | 2004-06-18 | 2011-04-12 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots |
US7935941B2 (en) | 2004-06-18 | 2011-05-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures |
US8148211B2 (en) | 2004-06-18 | 2012-04-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously |
US8193468B2 (en) | 2001-03-29 | 2012-06-05 | Gsi Group Corporation | Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure |
US8238007B2 (en) | 2001-02-16 | 2012-08-07 | Electro Scientific Industries, Inc. | On-the-fly laser beam path error correction for specimen target location processing |
US8383982B2 (en) | 2004-06-18 | 2013-02-26 | Electro Scientific Industries, Inc. | Methods and systems for semiconductor structure processing using multiple laser beam spots |
US8497450B2 (en) | 2001-02-16 | 2013-07-30 | Electro Scientific Industries, Inc. | On-the fly laser beam path dithering for enhancing throughput |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6232674A (en) * | 1985-08-03 | 1987-02-12 | Nippon Kogaku Kk <Nikon> | Laser-light attenuating apparatus |
-
1987
- 1987-08-12 JP JP62201112A patent/JPH0736959B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6232674A (en) * | 1985-08-03 | 1987-02-12 | Nippon Kogaku Kk <Nikon> | Laser-light attenuating apparatus |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5097714A (en) * | 1989-09-11 | 1992-03-24 | Kayaba Industry Co., Ltd. | Steering torque detecting apparatus |
JPH03237738A (en) * | 1990-02-14 | 1991-10-23 | Matsushita Electron Corp | Method and apparatus for analyzing semiconductor device |
US5247883A (en) * | 1990-07-09 | 1993-09-28 | Sony Corporation | Apparatus for making a printing plate and a printing plate thereof |
US8497450B2 (en) | 2001-02-16 | 2013-07-30 | Electro Scientific Industries, Inc. | On-the fly laser beam path dithering for enhancing throughput |
US8238007B2 (en) | 2001-02-16 | 2012-08-07 | Electro Scientific Industries, Inc. | On-the-fly laser beam path error correction for specimen target location processing |
US8193468B2 (en) | 2001-03-29 | 2012-06-05 | Gsi Group Corporation | Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure |
US7923306B2 (en) | 2004-06-18 | 2011-04-12 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots |
US7935941B2 (en) | 2004-06-18 | 2011-05-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures |
US8148211B2 (en) | 2004-06-18 | 2012-04-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously |
US7435927B2 (en) | 2004-06-18 | 2008-10-14 | Electron Scientific Industries, Inc. | Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset |
US8383982B2 (en) | 2004-06-18 | 2013-02-26 | Electro Scientific Industries, Inc. | Methods and systems for semiconductor structure processing using multiple laser beam spots |
JP2006239743A (en) * | 2005-03-03 | 2006-09-14 | V Technology Co Ltd | Laser beam machining method |
KR100940591B1 (en) * | 2007-10-05 | 2010-02-05 | (주)미래컴퍼니 | Precision manufacturing system and method using laser beam |
Also Published As
Publication number | Publication date |
---|---|
JPH0736959B2 (en) | 1995-04-26 |
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