JPS6444039A - Dielectric isolation substrate - Google Patents

Dielectric isolation substrate

Info

Publication number
JPS6444039A
JPS6444039A JP19977187A JP19977187A JPS6444039A JP S6444039 A JPS6444039 A JP S6444039A JP 19977187 A JP19977187 A JP 19977187A JP 19977187 A JP19977187 A JP 19977187A JP S6444039 A JPS6444039 A JP S6444039A
Authority
JP
Japan
Prior art keywords
region
island
islands
single crystalline
crystalline silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19977187A
Other languages
Japanese (ja)
Inventor
Hironori Inoue
Takaya Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP19977187A priority Critical patent/JPS6444039A/en
Publication of JPS6444039A publication Critical patent/JPS6444039A/en
Pending legal-status Critical Current

Links

Landscapes

  • Element Separation (AREA)

Abstract

PURPOSE:To eliminate an electrostatic coupling between single crystal islands of a dielectric isolation substrate by causing a part of a support layer of the substrate form single crystals entirely over a thicknesswise direction, surrounding the single crystalline island regions with the single crystallized region, and electrically shielding the single crystal island region of element forming regions. CONSTITUTION:Most of a single crystalline silicon island region 6 for forming an integrated circuit element is buried with single crystalline silicon of the composing material of a whole support layer 4, and a single crystalline silicon region 7 is formed entirely in a thicknesswise direction on the intermediate region of the islands 6 and 6. The resistivity of the region 7 is remarkably larger than that of a polycrystalline region due to the facts that grain boundaries like in other polycrystalline region are not provided in the region 7 and an impurity is doped. The region 7 is so formed as to surround the islands 6. Thus, an electrostatic coupling between the island regions of the substrate can be reduced to improve the element characteristics of an integrated circuit.
JP19977187A 1987-08-12 1987-08-12 Dielectric isolation substrate Pending JPS6444039A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19977187A JPS6444039A (en) 1987-08-12 1987-08-12 Dielectric isolation substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19977187A JPS6444039A (en) 1987-08-12 1987-08-12 Dielectric isolation substrate

Publications (1)

Publication Number Publication Date
JPS6444039A true JPS6444039A (en) 1989-02-16

Family

ID=16413341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19977187A Pending JPS6444039A (en) 1987-08-12 1987-08-12 Dielectric isolation substrate

Country Status (1)

Country Link
JP (1) JPS6444039A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100892226B1 (en) * 2001-07-23 2009-04-09 에이저 시스템즈 가디언 코포레이션 Method and structure for DC and RF shielding of integrated circuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100892226B1 (en) * 2001-07-23 2009-04-09 에이저 시스템즈 가디언 코포레이션 Method and structure for DC and RF shielding of integrated circuits

Similar Documents

Publication Publication Date Title
JPS5457875A (en) Semiconductor nonvolatile memory device
EP0251767A3 (en) Insulated gate type semiconductor device and method of producing the same
JPS56125868A (en) Thin-film semiconductor device
EP0277415A3 (en) Semiconductor device comprising an insulating structure and manufacturing process thereof
IE851905L (en) Semiconductor-on-insulator (soi) devices and soi ic¹fabrication method
GB2106419A (en) Growth of structures based on group iv semiconductor materials
JPS5669844A (en) Manufacture of semiconductor device
GB1260434A (en) Monolithic integrated circuit structure and method of fabrication
JPS6484669A (en) Thin film transistor
GB2211022A (en) Silicon-on-insulator field effect transistor with improved turn-on
JPS6444039A (en) Dielectric isolation substrate
JPS57167655A (en) Manufacture of insulating isolation substrate
JPS5678155A (en) Semiconductor device and manufacture thereof
EP0155698A3 (en) A method for manufacturing a semiconductor integrated circuit device provided with an improved isolation structure
JPS5559759A (en) Semiconductor device
JPS54107279A (en) Semiconductor device
EP0391081A3 (en) Fabrication and structure of semiconductor-on-insulator islands
JPS57111043A (en) Semiconductor integrated circuit and manufacture thereof
GB1325082A (en) Semiconductor devices
JPS56126971A (en) Thin film field effect element
JPS57210657A (en) Array substrate for display device
JPS57160156A (en) Semiconductor device
JPS52131482A (en) Dielectric insulation/isolation substrate
JPS5772373A (en) Semiconductor device
JPS5322382A (en) Production of dielectric isolating substrate