JPS6444034A - Inspecting device - Google Patents

Inspecting device

Info

Publication number
JPS6444034A
JPS6444034A JP62199719A JP19971987A JPS6444034A JP S6444034 A JPS6444034 A JP S6444034A JP 62199719 A JP62199719 A JP 62199719A JP 19971987 A JP19971987 A JP 19971987A JP S6444034 A JPS6444034 A JP S6444034A
Authority
JP
Japan
Prior art keywords
optimum
surface state
inspecting
throughput
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62199719A
Other languages
Japanese (ja)
Other versions
JP2633861B2 (en
Inventor
Yoshikazu Tanabe
Kenji Takamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62199719A priority Critical patent/JP2633861B2/en
Publication of JPS6444034A publication Critical patent/JPS6444034A/en
Application granted granted Critical
Publication of JP2633861B2 publication Critical patent/JP2633861B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To improve the reliability and yield of products and to improve the throughput of a manufacturing line by providing a data storage part for filing various parameters, and an operation input unit for automatically setting an optimum parameter by designating a file name corresponding to the surface state of a sample at the time of inspecting. CONSTITUTION:Optimum illuminating conditions corresponding to the surface state of a wafer, i.e., a surface material and surface shape, etc., are field in the format of parameters for forming the conditions in a data storage part 14, an optimum file for the surface state of the wafer to be inspected is drawn from an operation input unit 16 at the time of inspecting, and an electron beam is scanned by the optimum parameter in the film. Thus, the optimum inspection is rapidly performed. As a result, the reliability and yield of a semiconductor device are improved, and the throughput of a manufacturing line of the device is improved.
JP62199719A 1987-08-12 1987-08-12 SEM type inspection equipment Expired - Lifetime JP2633861B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62199719A JP2633861B2 (en) 1987-08-12 1987-08-12 SEM type inspection equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62199719A JP2633861B2 (en) 1987-08-12 1987-08-12 SEM type inspection equipment

Publications (2)

Publication Number Publication Date
JPS6444034A true JPS6444034A (en) 1989-02-16
JP2633861B2 JP2633861B2 (en) 1997-07-23

Family

ID=16412474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62199719A Expired - Lifetime JP2633861B2 (en) 1987-08-12 1987-08-12 SEM type inspection equipment

Country Status (1)

Country Link
JP (1) JP2633861B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005326206A (en) * 2004-05-13 2005-11-24 Jeol Ltd Analyzing condition sheet, analyzing condition recording medium and sample analyzer
CN112763432A (en) * 2020-12-25 2021-05-07 中国科学院上海高等研究院 Control method for automatically collecting absorption spectrum experimental data

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61104553A (en) * 1984-10-26 1986-05-22 Hitachi Ltd Electron microscope

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61104553A (en) * 1984-10-26 1986-05-22 Hitachi Ltd Electron microscope

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005326206A (en) * 2004-05-13 2005-11-24 Jeol Ltd Analyzing condition sheet, analyzing condition recording medium and sample analyzer
CN112763432A (en) * 2020-12-25 2021-05-07 中国科学院上海高等研究院 Control method for automatically collecting absorption spectrum experimental data

Also Published As

Publication number Publication date
JP2633861B2 (en) 1997-07-23

Similar Documents

Publication Publication Date Title
JPS5795056A (en) Appearance inspecting process
JPS5353393A (en) Ultrasonic probe
JPS6444034A (en) Inspecting device
JPS52149070A (en) Locating and inspecting method for semiconductor parts and die bonding device using the same
JPS5563854A (en) Method of manufacturing semiconductor device
JPS57128834A (en) Inspecting apparatus of foreign substance
DE3772614D1 (en) DEVICE FOR GOOD TESTING.
JPS53122489A (en) Cancer diagnosis apparatus by fluorescent polarization photometric microscope
JPS52149062A (en) Scanning electronic microscope
JPS5683044A (en) Wafer inspection device
JPS6457170A (en) Automatic analyzer
SU751428A1 (en) Electromagnetic separator
JPS545785A (en) Non-destructive inspecting apparatus
JPS5379593A (en) Surface inspecting method of objects and apparatus for the same
BOULAIRE et al. The analysis of defects and the possibilities brought by the scanning electron microscope
JPS5359486A (en) Reflection type electron-diffraction method
JPS52104862A (en) Scanning electronic microscope
JPS52144977A (en) Inspecting method of semiconductor devices
JPS54148483A (en) Automatic detecting method for reference mark of exposure
JPS55144533A (en) Apparatus for inspecting bottle
JPS52106268A (en) Scanning type electronic microscope and its method
JPS5337489A (en) Inspecting apparatus by ultrasonic wave
PALKUTI et al. Scanning photovoltage technique for high resolution non-destructive characterization of semiconductor wafers(Final Report, 2 Jul. 1984- 2 Jan. 1985)
JPS6450434A (en) Inspection device
JPS52156552A (en) Wafer inspection apparatus