JPS6442829A - Bonding device for ic chips - Google Patents

Bonding device for ic chips

Info

Publication number
JPS6442829A
JPS6442829A JP62199502A JP19950287A JPS6442829A JP S6442829 A JPS6442829 A JP S6442829A JP 62199502 A JP62199502 A JP 62199502A JP 19950287 A JP19950287 A JP 19950287A JP S6442829 A JPS6442829 A JP S6442829A
Authority
JP
Japan
Prior art keywords
chip
circuit board
coordinate system
image
image processor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62199502A
Other languages
English (en)
Inventor
Shigeki Danshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP62199502A priority Critical patent/JPS6442829A/ja
Publication of JPS6442829A publication Critical patent/JPS6442829A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP62199502A 1987-08-10 1987-08-10 Bonding device for ic chips Pending JPS6442829A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62199502A JPS6442829A (en) 1987-08-10 1987-08-10 Bonding device for ic chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62199502A JPS6442829A (en) 1987-08-10 1987-08-10 Bonding device for ic chips

Publications (1)

Publication Number Publication Date
JPS6442829A true JPS6442829A (en) 1989-02-15

Family

ID=16408888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62199502A Pending JPS6442829A (en) 1987-08-10 1987-08-10 Bonding device for ic chips

Country Status (1)

Country Link
JP (1) JPS6442829A (ja)

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