JPS6441155U - - Google Patents

Info

Publication number
JPS6441155U
JPS6441155U JP1987137167U JP13716787U JPS6441155U JP S6441155 U JPS6441155 U JP S6441155U JP 1987137167 U JP1987137167 U JP 1987137167U JP 13716787 U JP13716787 U JP 13716787U JP S6441155 U JPS6441155 U JP S6441155U
Authority
JP
Japan
Prior art keywords
control
led display
led chip
display body
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987137167U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987137167U priority Critical patent/JPS6441155U/ja
Publication of JPS6441155U publication Critical patent/JPS6441155U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例によるＬＥＤ表示体を
示す図、第２図は該ＬＥＤ表示体の制御用ＩＣを
示すブロツク構成図、第３図は該制御用ＩＣの発
振回路の具体的な回路構成を示す図、第４図は上
記制御用ＩＣの駆動回路の具体的な回路構成を示
す図、第５図は上記制御用ＩＣの擬似ランダムパ
ルス発生回路の具体的な回路構成を示す図、第６
図は従来のクリスマスツリー用電飾装置を示す図
である。 １ａ，１ｂ……リード、２……ＬＥＤチツプ、
３……ワイヤ、３ａ……スルーホール、４……封
止樹脂、５ａ……絶縁層、５ｂ……絶縁基板、６
ａ，６ｂ……第１、第２の制御用ＩＣ、７……発
振回路、８ａ，８ｂ……駆動回路、９……擬似ラ
ンダムパルス発生回路、１０……ＬＥＤ表示体。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) ＬＥＤチツプと該ＬＥＤチツプを点滅駆動
    させる制御用ＩＣとを一体に樹脂封止してなるこ
    とを特徴とするＬＥＤ表示体。 (2) 上記制御用ＩＣは逆Ｌ字状のリードの上部
    水平辺上に搭載されており、上記ＬＥＤチツプは
    該制御用ＩＣ上に絶縁層を介して配置されている
    ことを特徴とする実用新案登録請求の範囲第１項
    記載のＬＥＤ表示体。 (3) 上記ＬＥＤチツプ及び制御用ＩＣは、一対
    の真直ぐな各リードの上端に取り付けられた絶縁
    基板の表面及び裏面に取り付けられ、かつ該絶縁
    基板に形成されたスルーホールを介して相互に電
    気的に接続されていることを特徴とする実用新案
    登録請求の範囲第１項記載のＬＥＤ表示体。 (4) 上記制御用ＩＣは発振回路と、その出力を
    受けて上記ＬＥＤチツプを一定周期で点滅させる
    駆動回路とからなるものであることを特徴とする
    実用新案登録請求の範囲第１項ないし第３項のい
    ずれかに記載のＬＥＤ表示体。 (5) 上記制御用ＩＣは発振回路と、該発振回路
    の出力を受けて擬似ランダムパルスを発生させる
    パルス発生回路と、該擬似ランダムパルスにより
    上記ＬＥＤチツプを擬似ランダム周期で点滅させ
    る駆動回路とからなることを特徴とする実用新案
    登録請求の範囲第１項ないし第３項のいずれかに
    記載のＬＥＤ表示体。
JP1987137167U 1987-09-07 1987-09-07 Pending JPS6441155U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987137167U JPS6441155U (ja) 1987-09-07 1987-09-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987137167U JPS6441155U (ja) 1987-09-07 1987-09-07

Publications (1)

Publication Number Publication Date
JPS6441155U true JPS6441155U (ja) 1989-03-13

Family

ID=31398346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987137167U Pending JPS6441155U (ja) 1987-09-07 1987-09-07

Country Status (1)

Country Link
JP (1) JPS6441155U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05347434A (ja) * 1992-06-12 1993-12-27 Sharp Corp 抵抗内蔵型発光装置
JP2016213417A (ja) * 2015-05-13 2016-12-15 ローム株式会社 半導体発光装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS532174B2 (ja) * 1973-09-21 1978-01-26
JPS5825287A (ja) * 1982-07-12 1983-02-15 Mitsubishi Electric Corp 半導体感光発光素子
JPS6070784A (ja) * 1983-09-27 1985-04-22 Sharp Corp 発光ダイオ−ド表示装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS532174B2 (ja) * 1973-09-21 1978-01-26
JPS5825287A (ja) * 1982-07-12 1983-02-15 Mitsubishi Electric Corp 半導体感光発光素子
JPS6070784A (ja) * 1983-09-27 1985-04-22 Sharp Corp 発光ダイオ−ド表示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05347434A (ja) * 1992-06-12 1993-12-27 Sharp Corp 抵抗内蔵型発光装置
JP2016213417A (ja) * 2015-05-13 2016-12-15 ローム株式会社 半導体発光装置

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