JPS6070784A - 発光ダイオ−ド表示装置 - Google Patents

発光ダイオ−ド表示装置

Info

Publication number
JPS6070784A
JPS6070784A JP58181709A JP18170983A JPS6070784A JP S6070784 A JPS6070784 A JP S6070784A JP 58181709 A JP58181709 A JP 58181709A JP 18170983 A JP18170983 A JP 18170983A JP S6070784 A JPS6070784 A JP S6070784A
Authority
JP
Japan
Prior art keywords
emitting diode
light
light emitting
chip
diode element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58181709A
Other languages
English (en)
Inventor
Yoshizo Mihashi
三橋　由蔵
Masataka Miyata
正高 宮田
Masanao Koba
木場　正直
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP58181709A priority Critical patent/JPS6070784A/ja
Publication of JPS6070784A publication Critical patent/JPS6070784A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0756—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 く技術分野〉 本発明は発光ダイオードを点滅駆動させる回路を備えた
発光ダイオード表示装置に関するものである。
〈従来技術〉 発光ダイオードを用いた表示装置において、表示効果を
高めると共に消電力比等のために発光ダイオードを点滅
動作させる（とかしばしば行われている。このような点
滅動作を行わせる場合、従来の装置では１個又は複数個
の発光ダイオードに対して、′これらとは独立して別体
に設けられた駆動回路を装置組立て時等に電気的接続す
ることによって構成されていた。しかしながら各種電子
機器の小型軽量化が進む中で、発光ダイオード毎に上述
のようなフラッシング動作させる場合に１回路を別途に
配置する構造ではそのためのスペースが必要となり、小
型軽量化の妨はになり、また部品点数も多くなって経済
性の面からも改良が望まれていた。
〈発明の目的〉 本発明は上記従来装置の欠点を除去し、小型軽量化され
た発光タイオード表示装置を提供する。。
〈実施例〉 例えばバッテリチェッカと称し、発光ダイオード素子の
印加電圧が一定範囲内にあるときたけ。
発光ダイオードを動作させ、しかもその表示が点滅動作
する表示装置を挙げて説明する。発光タイオードを駆動
する回路は次に説明する回路から構成されるが、これは
ＩＣ化されて１つの半ｎＪ体チップ内に組み込まれる。
即ち、第１図において、入力端子１に与えられるレベル
検出のためのバッテリ出力電圧は第１比較器２及び第２
比較器３の各一方の入力端子に印加される。両比較器２
，３の各他方の入力端子には第１基準電圧■１又は第２
基準電圧Ｖ２が基準電圧発生回路４．５から与えられて
いる。該基準電圧発生回路４，５は例えばツェナーダイ
オードやＰＮ接合の順方向降下電圧を利用する回路で構
成される。
ここで上記第１基準電圧ｖ１及び第２基準電圧ｖ２はノ
イズや基準電圧の変動によるちらつき等を防止するため
に、第２図に示す如く許容範囲の電圧差Ｖ。をもって設
定されている。
比較器２と３の出力はインバータ６．７．８を介してフ
リップフロップを構成する２つのナントゲート９，１０
のセット端子とリセット端子にそれぞれ加えられる。ナ
ントゲート１０の出力はインバータ１．１を介してアン
ドゲート１２の一方の入力に加えられる。アンドゲート
１２の他方の入力には発振回路１３から点灯、非点灯の
間隔を制御するためのパルス信号が与えられる。アンド
ゲート１２の出力は限流抵抗１４を経てＩＣの出力端子
に導出され、発光タイオード１５に入力される。
上記構成よりなるため、電源電圧が１．６ボルトから１
０ボルトの間を変化し、基準電圧素子４は検出電圧が３
．１５ボルト、素子５は検出電圧が３゜０ボルトに設定
されていたとすると、電源電圧が充分高い場合、比較器
２，３はともにＨｉ　ｇ　ｂレベル出力となり、ナント
ゲート９．１０が構成するフリップフロップの出力はＨ
ｉｇｈレベルであり従ってゲート回路１２はオフ状態に
あり発光ダイオード素子１５は非点灯状態である。次に
電源電圧が少し低下して基準電圧素子４の検出電圧り、
下に低下した場合、比較器２はＬｏｗレベル出力となり
、インバータ６．７を通してナンドケート９に加えられ
る。しかしナントゲート１０の出力を変化させることが
できないので、ゲート回路１２のオフは続き、発光ダイ
オード１５は非点灯のままである。更に電圧が低下する
と、比較器３の出力もＬｏｗとなり、これかインバータ
８を介して加えられるのでナントゲート１０の出力をＬ
ｏｗレベルに変化させゲート回路１２を発振回路１３の
パルス信号に同期してオンさせるので発光ダイオード１
５は第２図に示す如く点滅動作するΩここで上記第１図
のＩＣチップはＩＩＩＩＩ＋２　以下の面積に構成する
ことが可能で、発光ダイオード素子ヲマウントするリー
ドフレームにマウントスることができる。即ちフラッシ
ング動作させるための駆動用ＩＣチップを内蔵した発光
ダイオード装置が構成される。第３図を用いて説明する
。
リードフレームは３本足で構成されており、中央のリー
ド片１６は幅広に形成されている。この幅広部分の中央
部は、リードフレームを作る際に凹部１７が形成されて
いる。リード片１６の頂部に周知の方法で発光ダイオー
ド素子１５がマウントされ、そしてＡノワイヤ１８が発
光ダイオード素子１５の電極とリード片１９間にボンデ
ィングされる。上記凹部１７の中に上記１ｃチツプ２０
かマウントされる。ＩＣチップ２０はそれぞれリード片
１６．１９．２１にそれぞれワイヤポンディングされる
。ＩＣチップ２０は黒色樹脂２２て封止される。発光ダ
イオード素子１５は赤外発光をするので暗赤色樹脂２３
て発光ダイオード素子１５とＩ　Ｃ２０をモールドする
。
〈効　果〉 以上本発明によれば、発光ダイオードをフラッジング動
作させるため、単純に点灯動作させる場合に比べて表示
効果が著しく高められる。また発光ダイオードを駆動す
る回路はＩＣ化されて発光ダイオードをマウントしたフ
レームと同一フレームにマウントされるため、従来の発
光ダイオードと比べて余り差のないスペースで駆動回路
まで設けることができ、装置の小型化を図ることかでき
る。
【図面の簡単な説明】
第１図は本発明による一実施例を示す回路ブロック図、
第２図は同実施例の動作を説明するため・ご。 め′図、第３図（ａ）Ｊ（ｂ）は第１図の回路を発光ダ
イオードと一体化した構造を示す正面図及び側面図であ
る。 １：入力端子、２，３：比較器、４，５：基準電圧発生
回路、９．１０：ナンドゲート、１２：アンドゲート、
１３：発振回路、１４：発光ダイオード、１６：リード
フレーム、２０：ｉｃチップ、２３：モールド樹脂。

Claims (1)

    【特許請求の範囲】
  1. １）発光ダイオードと、該発光ダイオードをフラッシン
    グ駆動させる回路を集積化したＩＣチップと、該ＩＣチ
    ップを樹脂モールドすると共に上記発光ダイオードと共
    に透光性樹脂で一体的にモールドしてなる発光ダイオー
    ド表示装置。
JP58181709A 1983-09-27 1983-09-27 発光ダイオ−ド表示装置 Pending JPS6070784A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58181709A JPS6070784A (ja) 1983-09-27 1983-09-27 発光ダイオ−ド表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58181709A JPS6070784A (ja) 1983-09-27 1983-09-27 発光ダイオ−ド表示装置

Publications (1)

Publication Number Publication Date
JPS6070784A true JPS6070784A (ja) 1985-04-22

Family

ID=16105481

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58181709A Pending JPS6070784A (ja) 1983-09-27 1983-09-27 発光ダイオ−ド表示装置

Country Status (1)

Country Link
JP (1) JPS6070784A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62241395A (ja) * 1986-04-11 1987-10-22 株式会社　エス・エム・シ− 多層配線基板
JPS63237468A (ja) * 1987-03-25 1988-10-03 Nec Yamagata Ltd 半導体集積回路
JPS6441155U (ja) * 1987-09-07 1989-03-13

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62241395A (ja) * 1986-04-11 1987-10-22 株式会社　エス・エム・シ− 多層配線基板
JPH0240227B2 (ja) * 1986-04-11 1990-09-10 Smc Corp
JPS63237468A (ja) * 1987-03-25 1988-10-03 Nec Yamagata Ltd 半導体集積回路
JPS6441155U (ja) * 1987-09-07 1989-03-13

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