JPS6437841A - Semiconductor wafer cleaner - Google Patents

Semiconductor wafer cleaner

Info

Publication number
JPS6437841A
JPS6437841A JP19368187A JP19368187A JPS6437841A JP S6437841 A JPS6437841 A JP S6437841A JP 19368187 A JP19368187 A JP 19368187A JP 19368187 A JP19368187 A JP 19368187A JP S6437841 A JPS6437841 A JP S6437841A
Authority
JP
Japan
Prior art keywords
brush
wafer
semiconductor wafer
active agent
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19368187A
Other languages
Japanese (ja)
Inventor
Masaki Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP19368187A priority Critical patent/JPS6437841A/en
Publication of JPS6437841A publication Critical patent/JPS6437841A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE:To reduce the sliding load of a brush, and to prevent the breakdown of a pattern on the surface of a wafer by sliding a brush member on the surface of the semiconductor wafer, to which water is injected, which is supplied with a surface active agent and which is turned. CONSTITUTION:The load of a brush 8 is adjusted by a weight 9 while water is injected onto the surface of a semiconductor wafer 1 attracted to a chuck drive section 2 and rotated around a shaft vertical to the surface of the section 2 through a pure water nozzle 10, and the brush 8 is lowered. When water injection is interrupted and a surface active agent is dropped onto the surface of the wafer 1 from a surface active agent nozzle 11, the suction force of foreign matters on the surface of the wafer 1 is weakened, and forsign matters are removed by the brush 8. The sliding load of the brush is reduced by using the surface active agent, and the semiconductor wafer is washed while the breakdown of a pattern on the surface of the wafer is prevented.
JP19368187A 1987-08-04 1987-08-04 Semiconductor wafer cleaner Pending JPS6437841A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19368187A JPS6437841A (en) 1987-08-04 1987-08-04 Semiconductor wafer cleaner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19368187A JPS6437841A (en) 1987-08-04 1987-08-04 Semiconductor wafer cleaner

Publications (1)

Publication Number Publication Date
JPS6437841A true JPS6437841A (en) 1989-02-08

Family

ID=16312015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19368187A Pending JPS6437841A (en) 1987-08-04 1987-08-04 Semiconductor wafer cleaner

Country Status (1)

Country Link
JP (1) JPS6437841A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0641131U (en) * 1993-10-01 1994-05-31 大日本スクリーン製造株式会社 Substrate cleaning equipment
US6277203B1 (en) 1998-09-29 2001-08-21 Lam Research Corporation Method and apparatus for cleaning low K dielectric and metal wafer surfaces
JP2005142524A (en) * 2003-04-29 2005-06-02 Soi Tec Silicon On Insulator Technologies Surface treatment of semiconductor wafer before bonding

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0641131U (en) * 1993-10-01 1994-05-31 大日本スクリーン製造株式会社 Substrate cleaning equipment
US6277203B1 (en) 1998-09-29 2001-08-21 Lam Research Corporation Method and apparatus for cleaning low K dielectric and metal wafer surfaces
US6319330B1 (en) 1998-09-29 2001-11-20 Lam Research Corporation Method and apparatus for cleaning low K dielectric and metal wafer surfaces
JP2005142524A (en) * 2003-04-29 2005-06-02 Soi Tec Silicon On Insulator Technologies Surface treatment of semiconductor wafer before bonding

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