JPS6419730A - Surface treatment device for semiconductor wafer - Google Patents
Surface treatment device for semiconductor waferInfo
- Publication number
- JPS6419730A JPS6419730A JP62175716A JP17571687A JPS6419730A JP S6419730 A JPS6419730 A JP S6419730A JP 62175716 A JP62175716 A JP 62175716A JP 17571687 A JP17571687 A JP 17571687A JP S6419730 A JPS6419730 A JP S6419730A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- cleaning water
- nozzle
- brush
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004381 surface treatment Methods 0.000 title 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 5
- 238000004140 cleaning Methods 0.000 abstract 4
- 238000001035 drying Methods 0.000 abstract 1
- 239000010419 fine particle Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000005201 scrubbing Methods 0.000 abstract 1
Abstract
PURPOSE:To prevent temporary drying on the circumference of the center part of a wafer and to avoid readhesion of fine particles by a method wherein a brush projects in the prescribed length from a brush holder, and the nozzle of cleaning water is arranged at the position at which the cleaning water can be fed to the center part of the rotating wafer. CONSTITUTION:A semiconductor wafer 20 is supported by the suction on a disc-like vacuum chuck 21, and it is rotated by the driving of a rotating shaft 22. Also, a nozzle 23, with which cleaning water will be supplied by jetting it to the center of the rotating wafer 20, is arranged on the upper part of the wafer 20, and a scrub 24 is arranged on the surface of the wafer 20 in such a manner that it can be shifted in an optional direction. After the pure water 27, jetted out from the nozzle 23 for cleaning water, has been spread out on the whole surface of the wafer by the rotation of the wafer, a scrubbing operation is started. The whole surface of the wafer can be scrubbed by shifting a brush 25 to the outermost circumference from the center point of rotation of the wafer 20.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62175716A JP2628168B2 (en) | 1987-07-14 | 1987-07-14 | Surface treatment equipment for semiconductor wafers |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62175716A JP2628168B2 (en) | 1987-07-14 | 1987-07-14 | Surface treatment equipment for semiconductor wafers |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6419730A true JPS6419730A (en) | 1989-01-23 |
JP2628168B2 JP2628168B2 (en) | 1997-07-09 |
Family
ID=16000987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62175716A Expired - Lifetime JP2628168B2 (en) | 1987-07-14 | 1987-07-14 | Surface treatment equipment for semiconductor wafers |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2628168B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0641131U (en) * | 1993-10-01 | 1994-05-31 | 大日本スクリーン製造株式会社 | Substrate cleaning equipment |
JPH0774134A (en) * | 1994-07-19 | 1995-03-17 | Dainippon Screen Mfg Co Ltd | Substrate washing method and substrate washer |
US6705331B2 (en) * | 2000-11-20 | 2004-03-16 | Dainippon Screen Mfg., Co., Ltd. | Substrate cleaning apparatus |
KR100841501B1 (en) * | 2005-12-13 | 2008-06-25 | 다이니폰 스크린 세이조우 가부시키가이샤 | Substrate processing method and substrate processing apparatus |
US9058977B2 (en) | 2012-12-06 | 2015-06-16 | Ebara Corporation | Substrate cleaning apparatus and substrate cleaning method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5627931A (en) * | 1979-08-16 | 1981-03-18 | Toshiba Corp | Surface treatment of semiconductor wafer |
JPS62125632A (en) * | 1985-11-26 | 1987-06-06 | Ricoh Co Ltd | Cleaning method for substrate of glass wafer, optical disc substrate or the like |
-
1987
- 1987-07-14 JP JP62175716A patent/JP2628168B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5627931A (en) * | 1979-08-16 | 1981-03-18 | Toshiba Corp | Surface treatment of semiconductor wafer |
JPS62125632A (en) * | 1985-11-26 | 1987-06-06 | Ricoh Co Ltd | Cleaning method for substrate of glass wafer, optical disc substrate or the like |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0641131U (en) * | 1993-10-01 | 1994-05-31 | 大日本スクリーン製造株式会社 | Substrate cleaning equipment |
JPH0774134A (en) * | 1994-07-19 | 1995-03-17 | Dainippon Screen Mfg Co Ltd | Substrate washing method and substrate washer |
US6705331B2 (en) * | 2000-11-20 | 2004-03-16 | Dainippon Screen Mfg., Co., Ltd. | Substrate cleaning apparatus |
US6901938B2 (en) | 2000-11-20 | 2005-06-07 | Dainippon Screen Mfg. Co., Ltd. | Substrate cleaning apparatus |
KR100841501B1 (en) * | 2005-12-13 | 2008-06-25 | 다이니폰 스크린 세이조우 가부시키가이샤 | Substrate processing method and substrate processing apparatus |
US9058977B2 (en) | 2012-12-06 | 2015-06-16 | Ebara Corporation | Substrate cleaning apparatus and substrate cleaning method |
Also Published As
Publication number | Publication date |
---|---|
JP2628168B2 (en) | 1997-07-09 |
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