JPS6419730A - Surface treatment device for semiconductor wafer - Google Patents

Surface treatment device for semiconductor wafer

Info

Publication number
JPS6419730A
JPS6419730A JP62175716A JP17571687A JPS6419730A JP S6419730 A JPS6419730 A JP S6419730A JP 62175716 A JP62175716 A JP 62175716A JP 17571687 A JP17571687 A JP 17571687A JP S6419730 A JPS6419730 A JP S6419730A
Authority
JP
Japan
Prior art keywords
wafer
cleaning water
nozzle
brush
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62175716A
Other languages
Japanese (ja)
Other versions
JP2628168B2 (en
Inventor
Yasuo Fukuda
Shunji Noda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osaka Titanium Co Ltd
Original Assignee
Osaka Titanium Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osaka Titanium Co Ltd filed Critical Osaka Titanium Co Ltd
Priority to JP62175716A priority Critical patent/JP2628168B2/en
Publication of JPS6419730A publication Critical patent/JPS6419730A/en
Application granted granted Critical
Publication of JP2628168B2 publication Critical patent/JP2628168B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To prevent temporary drying on the circumference of the center part of a wafer and to avoid readhesion of fine particles by a method wherein a brush projects in the prescribed length from a brush holder, and the nozzle of cleaning water is arranged at the position at which the cleaning water can be fed to the center part of the rotating wafer. CONSTITUTION:A semiconductor wafer 20 is supported by the suction on a disc-like vacuum chuck 21, and it is rotated by the driving of a rotating shaft 22. Also, a nozzle 23, with which cleaning water will be supplied by jetting it to the center of the rotating wafer 20, is arranged on the upper part of the wafer 20, and a scrub 24 is arranged on the surface of the wafer 20 in such a manner that it can be shifted in an optional direction. After the pure water 27, jetted out from the nozzle 23 for cleaning water, has been spread out on the whole surface of the wafer by the rotation of the wafer, a scrubbing operation is started. The whole surface of the wafer can be scrubbed by shifting a brush 25 to the outermost circumference from the center point of rotation of the wafer 20.
JP62175716A 1987-07-14 1987-07-14 Surface treatment equipment for semiconductor wafers Expired - Lifetime JP2628168B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62175716A JP2628168B2 (en) 1987-07-14 1987-07-14 Surface treatment equipment for semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62175716A JP2628168B2 (en) 1987-07-14 1987-07-14 Surface treatment equipment for semiconductor wafers

Publications (2)

Publication Number Publication Date
JPS6419730A true JPS6419730A (en) 1989-01-23
JP2628168B2 JP2628168B2 (en) 1997-07-09

Family

ID=16000987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62175716A Expired - Lifetime JP2628168B2 (en) 1987-07-14 1987-07-14 Surface treatment equipment for semiconductor wafers

Country Status (1)

Country Link
JP (1) JP2628168B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0641131U (en) * 1993-10-01 1994-05-31 大日本スクリーン製造株式会社 Substrate cleaning equipment
JPH0774134A (en) * 1994-07-19 1995-03-17 Dainippon Screen Mfg Co Ltd Substrate washing method and substrate washer
US6705331B2 (en) * 2000-11-20 2004-03-16 Dainippon Screen Mfg., Co., Ltd. Substrate cleaning apparatus
KR100841501B1 (en) * 2005-12-13 2008-06-25 다이니폰 스크린 세이조우 가부시키가이샤 Substrate processing method and substrate processing apparatus
US9058977B2 (en) 2012-12-06 2015-06-16 Ebara Corporation Substrate cleaning apparatus and substrate cleaning method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627931A (en) * 1979-08-16 1981-03-18 Toshiba Corp Surface treatment of semiconductor wafer
JPS62125632A (en) * 1985-11-26 1987-06-06 Ricoh Co Ltd Cleaning method for substrate of glass wafer, optical disc substrate or the like

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627931A (en) * 1979-08-16 1981-03-18 Toshiba Corp Surface treatment of semiconductor wafer
JPS62125632A (en) * 1985-11-26 1987-06-06 Ricoh Co Ltd Cleaning method for substrate of glass wafer, optical disc substrate or the like

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0641131U (en) * 1993-10-01 1994-05-31 大日本スクリーン製造株式会社 Substrate cleaning equipment
JPH0774134A (en) * 1994-07-19 1995-03-17 Dainippon Screen Mfg Co Ltd Substrate washing method and substrate washer
US6705331B2 (en) * 2000-11-20 2004-03-16 Dainippon Screen Mfg., Co., Ltd. Substrate cleaning apparatus
US6901938B2 (en) 2000-11-20 2005-06-07 Dainippon Screen Mfg. Co., Ltd. Substrate cleaning apparatus
KR100841501B1 (en) * 2005-12-13 2008-06-25 다이니폰 스크린 세이조우 가부시키가이샤 Substrate processing method and substrate processing apparatus
US9058977B2 (en) 2012-12-06 2015-06-16 Ebara Corporation Substrate cleaning apparatus and substrate cleaning method

Also Published As

Publication number Publication date
JP2628168B2 (en) 1997-07-09

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