JPS6435982A - Printed wiring board for surface mounting - Google Patents

Printed wiring board for surface mounting

Info

Publication number
JPS6435982A
JPS6435982A JP19194787A JP19194787A JPS6435982A JP S6435982 A JPS6435982 A JP S6435982A JP 19194787 A JP19194787 A JP 19194787A JP 19194787 A JP19194787 A JP 19194787A JP S6435982 A JPS6435982 A JP S6435982A
Authority
JP
Japan
Prior art keywords
circuit
surface mounting
wiring board
printed wiring
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19194787A
Other languages
Japanese (ja)
Inventor
Terutomi Hasegawa
Makio Ohata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP19194787A priority Critical patent/JPS6435982A/en
Publication of JPS6435982A publication Critical patent/JPS6435982A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To accurately mount without reducing high density mounting capacity by forming a dam between conductor circuits on which component terminals are mounted. CONSTITUTION:An auxiliary conductor circuit 8 is formed between pads of parts of conductor circuits 3 to which terminals 5 of surface mounting components are connected, and an insulating film 7 is formed on the circuit 8. Thus, the upper face of the pad of the part of the circuit 3 becomes lower than the upper face of the film 7. When a surface mounting component 4 is mounted on the printed wiring board 1, parts (pads) of the circuit 3 to be mounted is accurately positioned by a difference between the thickness of the circuit 8 and the film 7, and a short-circuit accident due to the bridge of solders can be prevented due to the step.
JP19194787A 1987-07-30 1987-07-30 Printed wiring board for surface mounting Pending JPS6435982A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19194787A JPS6435982A (en) 1987-07-30 1987-07-30 Printed wiring board for surface mounting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19194787A JPS6435982A (en) 1987-07-30 1987-07-30 Printed wiring board for surface mounting

Publications (1)

Publication Number Publication Date
JPS6435982A true JPS6435982A (en) 1989-02-07

Family

ID=16283106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19194787A Pending JPS6435982A (en) 1987-07-30 1987-07-30 Printed wiring board for surface mounting

Country Status (1)

Country Link
JP (1) JPS6435982A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02136361U (en) * 1989-04-19 1990-11-14
KR20030057283A (en) * 2001-12-28 2003-07-04 가부시끼가이샤 도시바 Printed wiring board having pads to solder circuit component, circuit module having the printed wiring board, and electronic apparatus equipped with the circuit module
FR2932314A1 (en) * 2008-06-09 2009-12-11 Valeo Equip Electr Moteur METHOD FOR WELDING AND POSITIONING AN INTEGRATED CIRCUIT WITH SURFACE MOUNTING ON A SUBSTRATE WITH INSULATED METAL RANGES AND ASSEMBLY MADE THEREBY

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02136361U (en) * 1989-04-19 1990-11-14
KR20030057283A (en) * 2001-12-28 2003-07-04 가부시끼가이샤 도시바 Printed wiring board having pads to solder circuit component, circuit module having the printed wiring board, and electronic apparatus equipped with the circuit module
FR2932314A1 (en) * 2008-06-09 2009-12-11 Valeo Equip Electr Moteur METHOD FOR WELDING AND POSITIONING AN INTEGRATED CIRCUIT WITH SURFACE MOUNTING ON A SUBSTRATE WITH INSULATED METAL RANGES AND ASSEMBLY MADE THEREBY
EP2134147A2 (en) * 2008-06-09 2009-12-16 Valeo Equipements Electriques Moteur Method of soldering and positioning an integrated circuit on a substrate and assembly manufactured by this method
EP2134147A3 (en) * 2008-06-09 2011-04-13 Valeo Equipements Electriques Moteur Method of soldering and positioning an integrated circuit on a substrate and assembly manufactured by this method

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