JPS6431586A - Grooving method for optical integrated circuit - Google Patents

Grooving method for optical integrated circuit

Info

Publication number
JPS6431586A
JPS6431586A JP62186039A JP18603987A JPS6431586A JP S6431586 A JPS6431586 A JP S6431586A JP 62186039 A JP62186039 A JP 62186039A JP 18603987 A JP18603987 A JP 18603987A JP S6431586 A JPS6431586 A JP S6431586A
Authority
JP
Japan
Prior art keywords
mask
integrated circuit
buffer
optical integrated
grooving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62186039A
Other languages
Japanese (ja)
Other versions
JP2581089B2 (en
Inventor
Makoto Suzuki
Satoshi Watanabe
Takashi Tsukamoto
Hikoharu Aoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brother Industries Ltd
Original Assignee
Brother Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brother Industries Ltd filed Critical Brother Industries Ltd
Priority to JP62186039A priority Critical patent/JP2581089B2/en
Publication of JPS6431586A publication Critical patent/JPS6431586A/en
Priority to US07/447,421 priority patent/US5018817A/en
Application granted granted Critical
Publication of JP2581089B2 publication Critical patent/JP2581089B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/04—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/255—Splicing of light guides, e.g. by fusion or bonding
    • G02B6/2552—Splicing of light guides, e.g. by fusion or bonding reshaping or reforming of light guides for coupling using thermal heating, e.g. tapering, forming of a lens on light guide ends
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3688—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier using laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Drying Of Semiconductors (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

PURPOSE:To enable high speed grooving and to use a mask as an optical integrated circuit board without removing it after grooving as well by fitting the mask in the specified pattern via a buffer on the optical integrated circuit consisting of a brittle member and executing grooving by projecting a laser beam. CONSTITUTION:The buffer 21 of SiO2 in >=1000A thickness is coated on the surface of an optical integrated circuit board 10 made by the material of a glass, LiNbO3, etc., having a big brittleness and difficult to work, the mask 22 of the material reflecting a CO2 laser bean of Al, Au, Cu, etc., is sticked thereon and after forming the notch part 22 in the size that an optical fiber 14 can be inserted to the end part thereof and a groove 12 is formed by evaporating instantaneously only the notch part by the scanning of the work head 24 of the CO2 laser beam. The optical fiber 14 is inserted into this groove 12 and the core 14a thereof is fixed by an ultraviolet ray hardening resin, etc., after adhering it to the light wave guide path 18 of the board 10. Since the attenuation of the light energy inside the optical wave guide path 18 by the metal mask 22 on the buffer 21 can be prevented with the existence of the buffer 21 the mask 22 is available without removing it.
JP62186039A 1987-07-24 1987-07-24 Method for manufacturing optical integrated circuit having mask Expired - Fee Related JP2581089B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62186039A JP2581089B2 (en) 1987-07-24 1987-07-24 Method for manufacturing optical integrated circuit having mask
US07/447,421 US5018817A (en) 1987-07-24 1989-12-07 Method of optically coupling optical fiber to waveguide on substrate, and optical device produced by the method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62186039A JP2581089B2 (en) 1987-07-24 1987-07-24 Method for manufacturing optical integrated circuit having mask

Publications (2)

Publication Number Publication Date
JPS6431586A true JPS6431586A (en) 1989-02-01
JP2581089B2 JP2581089B2 (en) 1997-02-12

Family

ID=16181331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62186039A Expired - Fee Related JP2581089B2 (en) 1987-07-24 1987-07-24 Method for manufacturing optical integrated circuit having mask

Country Status (1)

Country Link
JP (1) JP2581089B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227849A (en) * 1989-07-03 1993-07-13 Canon Kabushiki Kaisha Developing apparatus and developer carrying member usable therewith
US6756319B2 (en) 2000-07-06 2004-06-29 Samsung Electronics Co., Ltd. Silica microstructure and fabrication method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4895563U (en) * 1972-02-17 1973-11-14
JPS5834415A (en) * 1981-08-24 1983-02-28 Nippon Telegr & Teleph Corp <Ntt> Coupling method between optical waveguide and optical fiber
JPS59202407A (en) * 1983-05-02 1984-11-16 Nippon Telegr & Teleph Corp <Ntt> Manufacture of light guide
JPS61195791A (en) * 1985-02-27 1986-08-30 Takatou Seikan Kk Carving method by laser beam

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4895563U (en) * 1972-02-17 1973-11-14
JPS5834415A (en) * 1981-08-24 1983-02-28 Nippon Telegr & Teleph Corp <Ntt> Coupling method between optical waveguide and optical fiber
JPS59202407A (en) * 1983-05-02 1984-11-16 Nippon Telegr & Teleph Corp <Ntt> Manufacture of light guide
JPS61195791A (en) * 1985-02-27 1986-08-30 Takatou Seikan Kk Carving method by laser beam

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227849A (en) * 1989-07-03 1993-07-13 Canon Kabushiki Kaisha Developing apparatus and developer carrying member usable therewith
US6756319B2 (en) 2000-07-06 2004-06-29 Samsung Electronics Co., Ltd. Silica microstructure and fabrication method thereof

Also Published As

Publication number Publication date
JP2581089B2 (en) 1997-02-12

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees