JPS6430247A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS6430247A JPS6430247A JP18639887A JP18639887A JPS6430247A JP S6430247 A JPS6430247 A JP S6430247A JP 18639887 A JP18639887 A JP 18639887A JP 18639887 A JP18639887 A JP 18639887A JP S6430247 A JPS6430247 A JP S6430247A
- Authority
- JP
- Japan
- Prior art keywords
- element substrate
- substrate
- oxide film
- film
- impurity diffusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To prevent an element substrate from electrical floatation and thereby to suppress fluctuations in the element substrate potential at the switching-on of the elements by a method wherein a layer serving virtually as a conductive layer is provided on the element substrate on its side nearer to an insulating substrate. CONSTITUTION:Into the side of an element substrate 1 in contact with an insulating substrate 4, As<+> is driven, producing an n<-> impurity diffusion layer 2 (to virtually serve as a conductive layer) near the surface. The element substrate 1 and a supporting substrate 3, made for example of n<+> silicon, are bonded together, and the combination is subjected to annealing. The surface (the side nearer to the element substrate 1) is converted into a mirror-finished surface 1a, a through-oxide film 5 is formed on its surface, and implantation of P<+> ions is accomplished for the formation of a substrate contact section 6 reaching the impurity diffusion layer 2. The through-oxide film 5 is removed and, by using the conventional technique, a field oxide film 7, a source electrode 8, a drain electrode 9, a gate electrode 10, an interlayer insulating film 11, aluminum layers 121-123, and a covering film 13 are provided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18639887A JPS6430247A (en) | 1987-07-24 | 1987-07-24 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18639887A JPS6430247A (en) | 1987-07-24 | 1987-07-24 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6430247A true JPS6430247A (en) | 1989-02-01 |
Family
ID=16187702
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18639887A Pending JPS6430247A (en) | 1987-07-24 | 1987-07-24 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6430247A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5238875A (en) * | 1990-09-06 | 1993-08-24 | Shin-Etsu Handotai Co., Ltd. | Method of producing a bonded wafer |
-
1987
- 1987-07-24 JP JP18639887A patent/JPS6430247A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5238875A (en) * | 1990-09-06 | 1993-08-24 | Shin-Etsu Handotai Co., Ltd. | Method of producing a bonded wafer |
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