JPS6430103A - Conductive paste - Google Patents
Conductive pasteInfo
- Publication number
- JPS6430103A JPS6430103A JP18351587A JP18351587A JPS6430103A JP S6430103 A JPS6430103 A JP S6430103A JP 18351587 A JP18351587 A JP 18351587A JP 18351587 A JP18351587 A JP 18351587A JP S6430103 A JPS6430103 A JP S6430103A
- Authority
- JP
- Japan
- Prior art keywords
- mixing ratio
- peeling
- strength
- conductive paste
- 10pts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
- Conductive Materials (AREA)
Abstract
PURPOSE:To prevent the generation of void, to improve the peeling-off strength after a damp-proof process or a pressure cooker treatment, to eliminate a corrosive cutting or a poor connection of the electrode wiring, and to improve the reliability, by specifying the mixing ratio of a zircon aluminate type coupling agent to the filler. CONSTITUTION:To 100pts.wt. of conductive filler, 0.5 to 10pts.wt. of zircon aluminate type coupling agent is mixed, and more preferably, 1 to 4pts.wt. is mixed. When the mixing ratio is less than 0.5pts.wt., the peeling-off strength after the dampproofing precess can not be obtained. And the mixing ratio exceeding 10pts.wt. is not preferable, because the hardening property of the conductive paste is reduced and the cause of generating a void and the like is produced. By specifying the mixing ratio in such a way, the adhesion of the conductive paste, with the metallic base material such as lead frames and with semiconductive pellets is improved, and particularly the peeling-off strength after the pressure cooker process is improved extensively.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62183515A JP2720343B2 (en) | 1987-07-24 | 1987-07-24 | Conductive paste |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62183515A JP2720343B2 (en) | 1987-07-24 | 1987-07-24 | Conductive paste |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6430103A true JPS6430103A (en) | 1989-02-01 |
JP2720343B2 JP2720343B2 (en) | 1998-03-04 |
Family
ID=16137193
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62183515A Expired - Fee Related JP2720343B2 (en) | 1987-07-24 | 1987-07-24 | Conductive paste |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2720343B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5240057A (en) * | 1991-09-05 | 1993-08-31 | Shinichi Watanabe | High performance pneumatic radial tires with auxiliary belt layers |
US6346179B1 (en) | 1998-08-05 | 2002-02-12 | Ngk Spark Plug Co., Ltd. | Gas sensor |
JP2006083377A (en) * | 2004-08-18 | 2006-03-30 | Harima Chem Inc | Conductive adhesive and method for producing article using the conductive adhesive |
CN100389157C (en) * | 2005-08-16 | 2008-05-21 | 上海天鑫环境科技有限公司 | Novel electrically-conducting paint preparation method |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5062232A (en) * | 1973-10-05 | 1975-05-28 | ||
JPS60154403A (en) * | 1984-01-24 | 1985-08-14 | 東芝ケミカル株式会社 | Conductive paste |
JPS61127722A (en) * | 1984-11-26 | 1986-06-16 | Toshiba Chem Corp | Epoxy resin composition |
JPS61170003A (en) * | 1985-01-23 | 1986-07-31 | Hitachi Metals Ltd | Compound magnet and manufacture thereof |
JPS63178181A (en) * | 1987-01-20 | 1988-07-22 | Hitachi Chem Co Ltd | Adhesive composition |
-
1987
- 1987-07-24 JP JP62183515A patent/JP2720343B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5062232A (en) * | 1973-10-05 | 1975-05-28 | ||
JPS60154403A (en) * | 1984-01-24 | 1985-08-14 | 東芝ケミカル株式会社 | Conductive paste |
JPS61127722A (en) * | 1984-11-26 | 1986-06-16 | Toshiba Chem Corp | Epoxy resin composition |
JPS61170003A (en) * | 1985-01-23 | 1986-07-31 | Hitachi Metals Ltd | Compound magnet and manufacture thereof |
JPS63178181A (en) * | 1987-01-20 | 1988-07-22 | Hitachi Chem Co Ltd | Adhesive composition |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5240057A (en) * | 1991-09-05 | 1993-08-31 | Shinichi Watanabe | High performance pneumatic radial tires with auxiliary belt layers |
US6346179B1 (en) | 1998-08-05 | 2002-02-12 | Ngk Spark Plug Co., Ltd. | Gas sensor |
JP2006083377A (en) * | 2004-08-18 | 2006-03-30 | Harima Chem Inc | Conductive adhesive and method for producing article using the conductive adhesive |
CN100389157C (en) * | 2005-08-16 | 2008-05-21 | 上海天鑫环境科技有限公司 | Novel electrically-conducting paint preparation method |
Also Published As
Publication number | Publication date |
---|---|
JP2720343B2 (en) | 1998-03-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |