JPS55121395A - Heat conductive sealer - Google Patents

Heat conductive sealer

Info

Publication number
JPS55121395A
JPS55121395A JP2898079A JP2898079A JPS55121395A JP S55121395 A JPS55121395 A JP S55121395A JP 2898079 A JP2898079 A JP 2898079A JP 2898079 A JP2898079 A JP 2898079A JP S55121395 A JPS55121395 A JP S55121395A
Authority
JP
Japan
Prior art keywords
heat conductive
base resin
fiber
heat
heat conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2898079A
Other languages
Japanese (ja)
Inventor
Takao Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Refrigeration Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Refrigeration Co filed Critical Matsushita Refrigeration Co
Priority to JP2898079A priority Critical patent/JPS55121395A/en
Publication of JPS55121395A publication Critical patent/JPS55121395A/en
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2230/00—Sealing means

Abstract

PURPOSE: To improve the heat conductivity of the sealer without lower performance and increase in the heat conductive filler by filling the base resin with a metal fiber good in the heat conductivity or a pliable heat conductive fiber.
CONSTITUTION: A base resin 2 such as butyl is filled with a properly pliable heat conductive fiber such as aluminum fiber 3. Thus, an extremely higher contact is possible between the heat conductive fibers within the base resin as compared with the conventional powder. The heat conductivity can be improved without increased filler while the pliability of the fiber itself eliminates the diterioration in the tackiness, adhesivity and pliability of the base resin.
COPYRIGHT: (C)1980,JPO&Japio
JP2898079A 1979-03-13 1979-03-13 Heat conductive sealer Pending JPS55121395A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2898079A JPS55121395A (en) 1979-03-13 1979-03-13 Heat conductive sealer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2898079A JPS55121395A (en) 1979-03-13 1979-03-13 Heat conductive sealer

Publications (1)

Publication Number Publication Date
JPS55121395A true JPS55121395A (en) 1980-09-18

Family

ID=12263556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2898079A Pending JPS55121395A (en) 1979-03-13 1979-03-13 Heat conductive sealer

Country Status (1)

Country Link
JP (1) JPS55121395A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4403653A (en) * 1977-08-11 1983-09-13 Davidson Maxwell W Heat transfer elements
CN104280266A (en) * 2013-07-12 2015-01-14 欣特卡斯特公司 A sampling device for thermal analysis

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4403653A (en) * 1977-08-11 1983-09-13 Davidson Maxwell W Heat transfer elements
CN104280266A (en) * 2013-07-12 2015-01-14 欣特卡斯特公司 A sampling device for thermal analysis
JP2015017974A (en) * 2013-07-12 2015-01-29 シンターキャスト・アーべー Sampling device for thermal analysis
US9188513B2 (en) 2013-07-12 2015-11-17 Sintercast Ab Sampling device for thermal analysis

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