JPS6426432A - Sheet embossing device - Google Patents

Sheet embossing device

Info

Publication number
JPS6426432A
JPS6426432A JP62184398A JP18439887A JPS6426432A JP S6426432 A JPS6426432 A JP S6426432A JP 62184398 A JP62184398 A JP 62184398A JP 18439887 A JP18439887 A JP 18439887A JP S6426432 A JPS6426432 A JP S6426432A
Authority
JP
Japan
Prior art keywords
paper
hold board
thick paper
mold push
layer structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62184398A
Other languages
Japanese (ja)
Other versions
JPH07351B2 (en
Inventor
Makoto Kono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
REZATSUKU KK
Original Assignee
REZATSUKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by REZATSUKU KK filed Critical REZATSUKU KK
Priority to JP62184398A priority Critical patent/JPH07351B2/en
Publication of JPS6426432A publication Critical patent/JPS6426432A/en
Publication of JPH07351B2 publication Critical patent/JPH07351B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Making Paper Articles (AREA)

Abstract

PURPOSE: To easily and accurately match the position of a mold push groove of 3 layer laminated female paper to that of the knife edge for a hold board by a method wherein a guide pin for positioning is fitted to the hold board made to the required shape for the mold push and a positioning hole capable of coupling to a guide pin is provided on the hold board. CONSTITUTION: Preliminarily fit a 3-layer structure paper 10 on the hold board 3 with a thick paper 13 set on a hold board 3 side by coupling the edges of a plurality of guide pins 15 mounted on the hold board 3 to a plurality of positioning holes on the 3-layer structure paper 10 and further, the surface of the thick paper 13 for 3-layer structure paper 10 is adhered on the surface of a steel plate 7, only the hold board 3 being driven upward. Removed from the thick paper 11, together with the thick paper 13, is a cut piece segregated from the thick paper 11 between the cut lines 17a and 17b mark-pressed by a knife 14 which is mounted on the arm of an automatic designing machine when removing the thick paper 13 from the thick paper 11. Thereafter, the required shape of a mold push groove 8 is formed to obtain a female paper 11' in which the position of the knife edge 5a for mold push of the hold board 3 high-accurately matches the position of a mold push groove 8.
JP62184398A 1987-07-22 1987-07-22 Sheet embossing device Expired - Lifetime JPH07351B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62184398A JPH07351B2 (en) 1987-07-22 1987-07-22 Sheet embossing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62184398A JPH07351B2 (en) 1987-07-22 1987-07-22 Sheet embossing device

Publications (2)

Publication Number Publication Date
JPS6426432A true JPS6426432A (en) 1989-01-27
JPH07351B2 JPH07351B2 (en) 1995-01-11

Family

ID=16152472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62184398A Expired - Lifetime JPH07351B2 (en) 1987-07-22 1987-07-22 Sheet embossing device

Country Status (1)

Country Link
JP (1) JPH07351B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010284868A (en) * 2009-06-11 2010-12-24 Nippon Die Steel Kk Groove member for forming ruled line
JP2014034078A (en) * 2012-08-08 2014-02-24 Shizuo Sato Face plate device in punching machine
US8803663B2 (en) 2008-12-25 2014-08-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, electronic appliance using semiconductor device, and document using semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6067900U (en) * 1983-10-17 1985-05-14 株式会社菱屋 Cutting die device for paper processing

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6067900U (en) * 1983-10-17 1985-05-14 株式会社菱屋 Cutting die device for paper processing

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8803663B2 (en) 2008-12-25 2014-08-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, electronic appliance using semiconductor device, and document using semiconductor device
JP2010284868A (en) * 2009-06-11 2010-12-24 Nippon Die Steel Kk Groove member for forming ruled line
JP2014034078A (en) * 2012-08-08 2014-02-24 Shizuo Sato Face plate device in punching machine

Also Published As

Publication number Publication date
JPH07351B2 (en) 1995-01-11

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