JPS6426367U - - Google Patents

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Publication number
JPS6426367U
JPS6426367U JP11971387U JP11971387U JPS6426367U JP S6426367 U JPS6426367 U JP S6426367U JP 11971387 U JP11971387 U JP 11971387U JP 11971387 U JP11971387 U JP 11971387U JP S6426367 U JPS6426367 U JP S6426367U
Authority
JP
Japan
Prior art keywords
winding
thin film
chamber
forming apparatus
adherend substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11971387U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11971387U priority Critical patent/JPS6426367U/ja
Publication of JPS6426367U publication Critical patent/JPS6426367U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す巻取式薄膜形
成装置の模式的断面図を示す。 1……真空槽、2……排気口、3……巻出軸、
4……巻取軸、5……処理ドラム、6……ターゲ
ツト、7……ガス噴出管、8……仕切板、9……
遮蔽板、10……コンダクタンスバルブ、11…
…被着基体(フイルム)、12,13……ガイド
ロール、A……巻取室、B……スパツタ処理室。
FIG. 1 shows a schematic cross-sectional view of a winding type thin film forming apparatus showing an embodiment of the present invention. 1... Vacuum chamber, 2... Exhaust port, 3... Unwinding shaft,
4... Winding shaft, 5... Processing drum, 6... Target, 7... Gas ejection pipe, 8... Partition plate, 9...
Shielding plate, 10... Conductance valve, 11...
...adhesion substrate (film), 12, 13... guide roll, A... winding chamber, B... sputter processing chamber.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プラスチツクフイルム等の被着基体に薄膜を形
成させる巻取式薄膜形成装置であつて、前記巻取
式薄膜形成装置は、仕切壁と処理ドラムにより分
離された巻取室と処理室とを具備しており、かつ
前記巻取室には前記被着基体を巻出す巻出軸と、
被着基体を巻取る巻取軸と、ガイドロールとを備
えており、一方処理室にはターゲツトと、ガス噴
出管とを備えており、かつ前記仕切壁にはガス噴
出管からガスの圧力を調整するための移動自在な
遮蔽板が設けられており、スパツタ処理中におい
て被着基体からデガツシングした不純物ガスが巻
取室側で排気されうるようにしたことを特徴とす
る巻取式薄膜形成装置。
A winding type thin film forming apparatus for forming a thin film on an adherend substrate such as a plastic film, the winding type thin film forming apparatus comprising a winding chamber and a processing chamber separated by a partition wall and a processing drum. and an unwinding shaft for unwinding the adherend substrate in the winding chamber;
It is equipped with a winding shaft for winding up the adherend substrate and a guide roll, while the processing chamber is equipped with a target and a gas jet pipe, and the partition wall is equipped with a gas pressure from the gas jet pipe. A winding-type thin film forming apparatus characterized in that a movable shielding plate for adjustment is provided, and impurity gas degushed from an adherend substrate during sputtering processing can be exhausted from the winding chamber side. .
JP11971387U 1987-08-04 1987-08-04 Pending JPS6426367U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11971387U JPS6426367U (en) 1987-08-04 1987-08-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11971387U JPS6426367U (en) 1987-08-04 1987-08-04

Publications (1)

Publication Number Publication Date
JPS6426367U true JPS6426367U (en) 1989-02-14

Family

ID=31365183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11971387U Pending JPS6426367U (en) 1987-08-04 1987-08-04

Country Status (1)

Country Link
JP (1) JPS6426367U (en)

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