JPS63127125U - - Google Patents

Info

Publication number
JPS63127125U
JPS63127125U JP1770387U JP1770387U JPS63127125U JP S63127125 U JPS63127125 U JP S63127125U JP 1770387 U JP1770387 U JP 1770387U JP 1770387 U JP1770387 U JP 1770387U JP S63127125 U JPS63127125 U JP S63127125U
Authority
JP
Japan
Prior art keywords
chamber
processing
dummy wafer
vacuum
processing chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1770387U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1770387U priority Critical patent/JPS63127125U/ja
Publication of JPS63127125U publication Critical patent/JPS63127125U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例であるプラズマ処理
装置を示す平断面図である。 １……処理室、２……ロード室、６……ダミー
ウエハ、７……搬送アーム。 FIG. 1 is a plan cross-sectional view showing a plasma processing apparatus which is an embodiment of the present invention. 1...Processing chamber, 2...Loading chamber, 6...Dummy wafer, 7...Transfer arm.

Claims (1)

【実用新案登録請求の範囲】 処理ガスが供給され所定圧力に減圧排気された
空間内にプラズマを生じさせて試料の処理を行う
処理室と、 該処理室にゲートバルブを介して隣設した真空
予備室と、 該予備室内に収容したダミーウエハと、 該ダミーウエハを前記真空予備室と前記処理室
との間で搬送する搬送手段とを具備したことを特
徴とするプラズマ処理装置。[Scope of Claim for Utility Model Registration] A processing chamber in which a sample is processed by generating plasma in a space supplied with processing gas and evacuated to a predetermined pressure, and a vacuum installed adjacent to the processing chamber via a gate valve. A plasma processing apparatus comprising: a preliminary chamber; a dummy wafer accommodated in the preliminary chamber; and a transport means for conveying the dummy wafer between the vacuum preliminary chamber and the processing chamber.
JP1770387U 1987-02-12 1987-02-12 Pending JPS63127125U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1770387U JPS63127125U (en) 1987-02-12 1987-02-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1770387U JPS63127125U (en) 1987-02-12 1987-02-12

Publications (1)

Publication Number Publication Date
JPS63127125U true JPS63127125U (en) 1988-08-19

Family

ID=30810697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1770387U Pending JPS63127125U (en) 1987-02-12 1987-02-12

Country Status (1)

Country Link
JP (1) JPS63127125U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02106037A (en) * 1988-10-14 1990-04-18 Tokyo Electron Ltd Treatment method
JPH0412628U (en) * 1990-05-22 1992-01-31
EP0805481A2 (en) * 1990-08-29 1997-11-05 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
JP2004311894A (en) * 2003-04-10 2004-11-04 Renesas Technology Corp Manufacturing method of semiconductor device
JP2011222825A (en) * 2010-04-12 2011-11-04 Tokyo Electron Ltd Processing apparatus for body to be processed
JP2017011023A (en) * 2015-06-18 2017-01-12 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02106037A (en) * 1988-10-14 1990-04-18 Tokyo Electron Ltd Treatment method
JPH0412628U (en) * 1990-05-22 1992-01-31
EP0805481A2 (en) * 1990-08-29 1997-11-05 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
EP0856875A2 (en) * 1990-08-29 1998-08-05 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
EP0856875B1 (en) * 1990-08-29 2003-05-07 Hitachi, Ltd. Operating method for vacuum processing apparatus
EP0805481B1 (en) * 1990-08-29 2006-06-21 Hitachi, Ltd. Operating method for vacuum processing apparatus
JP2004311894A (en) * 2003-04-10 2004-11-04 Renesas Technology Corp Manufacturing method of semiconductor device
JP4585178B2 (en) * 2003-04-10 2010-11-24 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor device
JP2011222825A (en) * 2010-04-12 2011-11-04 Tokyo Electron Ltd Processing apparatus for body to be processed
JP2017011023A (en) * 2015-06-18 2017-01-12 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method

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