JPS6425580A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS6425580A JPS6425580A JP18251487A JP18251487A JPS6425580A JP S6425580 A JPS6425580 A JP S6425580A JP 18251487 A JP18251487 A JP 18251487A JP 18251487 A JP18251487 A JP 18251487A JP S6425580 A JPS6425580 A JP S6425580A
- Authority
- JP
- Japan
- Prior art keywords
- optoelectronic integrated
- board
- integrated circuit
- light
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Optical Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18251487A JPS6425580A (en) | 1987-07-22 | 1987-07-22 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18251487A JPS6425580A (en) | 1987-07-22 | 1987-07-22 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6425580A true JPS6425580A (en) | 1989-01-27 |
Family
ID=16119629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18251487A Pending JPS6425580A (en) | 1987-07-22 | 1987-07-22 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6425580A (ja) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0623980A3 (en) * | 1993-05-06 | 1995-02-15 | Cselt Centro Studi Lab Telecom | Transversely emitting semiconductor laser and coupling to an optical fiber. |
| JPH07183570A (ja) * | 1993-12-24 | 1995-07-21 | Nec Corp | マルチチップモジュール |
| JP2002174744A (ja) * | 2000-12-06 | 2002-06-21 | Toppan Printing Co Ltd | 光部品搭載用基板及び実装基板、並びにプリント基板 |
| JP2002174742A (ja) * | 2000-12-06 | 2002-06-21 | Toppan Printing Co Ltd | 光部品搭載用基板及び実装基板、並びにプリント基板 |
| KR100478379B1 (ko) * | 2002-03-19 | 2005-03-24 | 학교법인 한국정보통신학원 | 광도파로와 마이크로렌즈를 이용한 칩간 광연결 구조 |
| JP2011069925A (ja) * | 2009-09-24 | 2011-04-07 | Nippon Telegr & Teleph Corp <Ntt> | 光回路アセンブリ |
-
1987
- 1987-07-22 JP JP18251487A patent/JPS6425580A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0623980A3 (en) * | 1993-05-06 | 1995-02-15 | Cselt Centro Studi Lab Telecom | Transversely emitting semiconductor laser and coupling to an optical fiber. |
| JPH07183570A (ja) * | 1993-12-24 | 1995-07-21 | Nec Corp | マルチチップモジュール |
| JP2002174744A (ja) * | 2000-12-06 | 2002-06-21 | Toppan Printing Co Ltd | 光部品搭載用基板及び実装基板、並びにプリント基板 |
| JP2002174742A (ja) * | 2000-12-06 | 2002-06-21 | Toppan Printing Co Ltd | 光部品搭載用基板及び実装基板、並びにプリント基板 |
| KR100478379B1 (ko) * | 2002-03-19 | 2005-03-24 | 학교법인 한국정보통신학원 | 광도파로와 마이크로렌즈를 이용한 칩간 광연결 구조 |
| JP2011069925A (ja) * | 2009-09-24 | 2011-04-07 | Nippon Telegr & Teleph Corp <Ntt> | 光回路アセンブリ |
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