JPS642499Y2 - - Google Patents
Info
- Publication number
- JPS642499Y2 JPS642499Y2 JP1982065822U JP6582282U JPS642499Y2 JP S642499 Y2 JPS642499 Y2 JP S642499Y2 JP 1982065822 U JP1982065822 U JP 1982065822U JP 6582282 U JP6582282 U JP 6582282U JP S642499 Y2 JPS642499 Y2 JP S642499Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- welding position
- thermosetting resin
- metal wire
- tightly wound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003466 welding Methods 0.000 claims description 36
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 25
- 229920001187 thermosetting polymer Polymers 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 230000003014 reinforcing effect Effects 0.000 claims description 20
- 230000002787 reinforcement Effects 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- 238000005452 bending Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Cable Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6582282U JPS58168828U (ja) | 1982-05-06 | 1982-05-06 | 鉛被溶接位置の補強部 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6582282U JPS58168828U (ja) | 1982-05-06 | 1982-05-06 | 鉛被溶接位置の補強部 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58168828U JPS58168828U (ja) | 1983-11-10 |
| JPS642499Y2 true JPS642499Y2 (fr) | 1989-01-20 |
Family
ID=30075755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6582282U Granted JPS58168828U (ja) | 1982-05-06 | 1982-05-06 | 鉛被溶接位置の補強部 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58168828U (fr) |
-
1982
- 1982-05-06 JP JP6582282U patent/JPS58168828U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58168828U (ja) | 1983-11-10 |
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