JPS642438U - - Google Patents

Info

Publication number
JPS642438U
JPS642438U JP1987096440U JP9644087U JPS642438U JP S642438 U JPS642438 U JP S642438U JP 1987096440 U JP1987096440 U JP 1987096440U JP 9644087 U JP9644087 U JP 9644087U JP S642438 U JPS642438 U JP S642438U
Authority
JP
Japan
Prior art keywords
rotor
cradle
drying device
draining
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987096440U
Other languages
English (en)
Japanese (ja)
Other versions
JPH069499Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987096440U priority Critical patent/JPH069499Y2/ja
Priority to US07/207,504 priority patent/US4907349A/en
Priority to DE3821067A priority patent/DE3821067A1/de
Priority to KR1019880007684A priority patent/KR950012659B1/ko
Publication of JPS642438U publication Critical patent/JPS642438U/ja
Application granted granted Critical
Publication of JPH069499Y2 publication Critical patent/JPH069499Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00Drying solid materials or objects by processes not involving the application of heat
    • F26B5/08Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Centrifugal Separators (AREA)
JP1987096440U 1987-06-23 1987-06-23 半導体材料の水切乾燥装置 Expired - Lifetime JPH069499Y2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1987096440U JPH069499Y2 (ja) 1987-06-23 1987-06-23 半導体材料の水切乾燥装置
US07/207,504 US4907349A (en) 1987-06-23 1988-06-16 Spin drier for semiconductor materials
DE3821067A DE3821067A1 (de) 1987-06-23 1988-06-22 Rotationstrockner fuer halbleitermaterialien
KR1019880007684A KR950012659B1 (ko) 1987-06-23 1988-06-23 반도체 재료의 물기를 빼는 건조장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987096440U JPH069499Y2 (ja) 1987-06-23 1987-06-23 半導体材料の水切乾燥装置

Publications (2)

Publication Number Publication Date
JPS642438U true JPS642438U (US20020051482A1-20020502-M00057.png) 1989-01-09
JPH069499Y2 JPH069499Y2 (ja) 1994-03-09

Family

ID=14165077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987096440U Expired - Lifetime JPH069499Y2 (ja) 1987-06-23 1987-06-23 半導体材料の水切乾燥装置

Country Status (4)

Country Link
US (1) US4907349A (US20020051482A1-20020502-M00057.png)
JP (1) JPH069499Y2 (US20020051482A1-20020502-M00057.png)
KR (1) KR950012659B1 (US20020051482A1-20020502-M00057.png)
DE (1) DE3821067A1 (US20020051482A1-20020502-M00057.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011209283A (ja) * 2011-03-11 2011-10-20 Dainippon Printing Co Ltd 力学量センサ及びその製造方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4777732A (en) * 1986-06-12 1988-10-18 Oki Electric Industry Co., Ltd. Wafer centrifugal drying apparatus
US5174045A (en) * 1991-05-17 1992-12-29 Semitool, Inc. Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers
JP3190929B2 (ja) * 1992-10-26 2001-07-23 保 目崎 半導体材料の水切乾燥装置
US5664337A (en) * 1996-03-26 1997-09-09 Semitool, Inc. Automated semiconductor processing systems
US5784797A (en) * 1994-04-28 1998-07-28 Semitool, Inc. Carrierless centrifugal semiconductor processing system
JP2709568B2 (ja) * 1994-06-30 1998-02-04 日本プレシジョン・サーキッツ株式会社 ダウンフロー型スピンドライヤ
US6645355B2 (en) 1996-07-15 2003-11-11 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6091498A (en) 1996-07-15 2000-07-18 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US8028978B2 (en) * 1996-07-15 2011-10-04 Semitool, Inc. Wafer handling system
US6536131B2 (en) * 1996-07-15 2003-03-25 Semitool, Inc. Wafer handling system
US6062239A (en) * 1998-06-30 2000-05-16 Semitool, Inc. Cross flow centrifugal processor
US6125863A (en) * 1998-06-30 2000-10-03 Semitool, Inc. Offset rotor flat media processor
CN102679714A (zh) * 2012-05-30 2012-09-19 无锡市优耐特石化装备有限公司 一种带连接圈的甩干机内桶

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61179741U (US20020051482A1-20020502-M00057.png) * 1985-04-25 1986-11-10

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4525938A (en) * 1984-01-09 1985-07-02 Seiichiro Aigo Spin drier for semiconductor material
JPS629635A (ja) * 1985-07-08 1987-01-17 Oki Electric Ind Co Ltd 半導体ウエハの回転乾燥装置
US4777732A (en) * 1986-06-12 1988-10-18 Oki Electric Industry Co., Ltd. Wafer centrifugal drying apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61179741U (US20020051482A1-20020502-M00057.png) * 1985-04-25 1986-11-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011209283A (ja) * 2011-03-11 2011-10-20 Dainippon Printing Co Ltd 力学量センサ及びその製造方法

Also Published As

Publication number Publication date
JPH069499Y2 (ja) 1994-03-09
KR950012659B1 (ko) 1995-10-19
KR890001158A (ko) 1989-03-18
DE3821067A1 (de) 1989-01-05
US4907349A (en) 1990-03-13

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