JPS642438U - - Google Patents

Info

Publication number
JPS642438U
JPS642438U JP1987096440U JP9644087U JPS642438U JP S642438 U JPS642438 U JP S642438U JP 1987096440 U JP1987096440 U JP 1987096440U JP 9644087 U JP9644087 U JP 9644087U JP S642438 U JPS642438 U JP S642438U
Authority
JP
Japan
Prior art keywords
rotor
cradle
drying device
draining
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987096440U
Other languages
English (en)
Other versions
JPH069499Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987096440U priority Critical patent/JPH069499Y2/ja
Priority to US07/207,504 priority patent/US4907349A/en
Priority to DE3821067A priority patent/DE3821067A1/de
Priority to KR1019880007684A priority patent/KR950012659B1/ko
Publication of JPS642438U publication Critical patent/JPS642438U/ja
Application granted granted Critical
Publication of JPH069499Y2 publication Critical patent/JPH069499Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Centrifugal Separators (AREA)

Description

【図面の簡単な説明】
第１図は本考案による水切乾燥装置の要部を示
す斜視図、第２図はこの装置全体を示す斜視図、
第３図はその縦断面図、第４図はキヤリアとロー
タの一部を示す平面図、第５図はロータの一部を
外側から見た側面図、第６図はこの装置で用いら
れるクレイドルの斜視図、第７図はクレイドルの
端壁の平面図、第８図はロータに装着状態のクレ
イドルとキヤリアの関係を示す平面図、第９図は
第５図の線Ａ−Ａ断面図、第１０図は従来のクレ
イドルを示す斜視図、そして第１１図は従来のク
レイドルにキヤリアが組み込まれた状態を示す部
分的な断面図である。 図中、１０：ロータの基板、１１：抑えロツド
、１２：受け部、１５：止め棒、２０：クレイド
ル、２３：突片、３１：衝合部分。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) ケーシングおよびその内で回転されるロー
    タからなり、半導体材料を収めたキヤリアはクレ
    イドル内に収められて前記ロータの所定位置に取
    付けられるようになつている水切乾燥装置におい
    て、前記ロータの各所定位置には後記抑えロツド
    の軸線方向に互いに離れ且つ該ロータの基板に平
    行に固定された少なくも一対の抑えロツドがあり
    且つ各前記抑えロツドの互いに近接する端部の近
    くにあつて前記端部が受ける半径方向外方の力を
    支える止め棒が前記ロータの基板に垂直に固定さ
    れ、各前記抑えロツドの前記端部には前記クレイ
    ドル内に収められたキヤリアの脚部を挟む受け部
    が設けられ、且つ前記クレイドルには各前記抑え
    ロツドの前記端部の反対側の端部に衝合する部分
    が設けられていることを特徴とする半導体材料の
    水切乾燥装置。 (2) 前記抑えロツドは対応の前記抑えロツドに
    対し相対して同じ高さ位置に在る実用新案登録請
    求の範囲第(1)項記載の水切乾燥装置。 (3) 前記ロータの各所定位置には２対の前記抑
    えロツドが設けられている実用新案登録請求の範
    囲第(1)項記載の水切乾燥装置。 (4) 前記キヤリアの一対の脚部の両端はそれぞ
    れ前記クレイドルに形成された対状の突片間で受
    けられる実用新案登録請求の範囲第(1)項記載の
    水切乾燥装置。 (5) 各前記受け部は一対のカラーからなる実用
    新案登録請求の範囲第(1)項記載の水切乾燥装置
    。 (6) 各前記抑えロツドの端部に衝合するクレイ
    ドルの前記部分は突起または突条である実用新案
    登録請求の範囲第(1)項記載の水切乾燥装置。
JP1987096440U 1987-06-23 1987-06-23 半導体材料の水切乾燥装置 Expired - Lifetime JPH069499Y2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1987096440U JPH069499Y2 (ja) 1987-06-23 1987-06-23 半導体材料の水切乾燥装置
US07/207,504 US4907349A (en) 1987-06-23 1988-06-16 Spin drier for semiconductor materials
DE3821067A DE3821067A1 (de) 1987-06-23 1988-06-22 Rotationstrockner fuer halbleitermaterialien
KR1019880007684A KR950012659B1 (ko) 1987-06-23 1988-06-23 반도체 재료의 물기를 빼는 건조장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987096440U JPH069499Y2 (ja) 1987-06-23 1987-06-23 半導体材料の水切乾燥装置

Publications (2)

Publication Number Publication Date
JPS642438U true JPS642438U (ja) 1989-01-09
JPH069499Y2 JPH069499Y2 (ja) 1994-03-09

Family

ID=14165077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987096440U Expired - Lifetime JPH069499Y2 (ja) 1987-06-23 1987-06-23 半導体材料の水切乾燥装置

Country Status (4)

Country Link
US (1) US4907349A (ja)
JP (1) JPH069499Y2 (ja)
KR (1) KR950012659B1 (ja)
DE (1) DE3821067A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011209283A (ja) * 2011-03-11 2011-10-20 Dainippon Printing Co Ltd 力学量センサ及びその製造方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4777732A (en) * 1986-06-12 1988-10-18 Oki Electric Industry Co., Ltd. Wafer centrifugal drying apparatus
US5174045A (en) * 1991-05-17 1992-12-29 Semitool, Inc. Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers
JP3190929B2 (ja) * 1992-10-26 2001-07-23 保 目崎 半導体材料の水切乾燥装置
US5664337A (en) * 1996-03-26 1997-09-09 Semitool, Inc. Automated semiconductor processing systems
US5784797A (en) * 1994-04-28 1998-07-28 Semitool, Inc. Carrierless centrifugal semiconductor processing system
JP2709568B2 (ja) * 1994-06-30 1998-02-04 日本プレシジョン・サーキッツ株式会社 ダウンフロー型スピンドライヤ
US8028978B2 (en) * 1996-07-15 2011-10-04 Semitool, Inc. Wafer handling system
US6536131B2 (en) * 1996-07-15 2003-03-25 Semitool, Inc. Wafer handling system
US6645355B2 (en) 1996-07-15 2003-11-11 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6091498A (en) * 1996-07-15 2000-07-18 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6062239A (en) * 1998-06-30 2000-05-16 Semitool, Inc. Cross flow centrifugal processor
US6125863A (en) * 1998-06-30 2000-10-03 Semitool, Inc. Offset rotor flat media processor
CN102679714A (zh) * 2012-05-30 2012-09-19 无锡市优耐特石化装备有限公司 一种带连接圈的甩干机内桶

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61179741U (ja) * 1985-04-25 1986-11-10

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4525938A (en) * 1984-01-09 1985-07-02 Seiichiro Aigo Spin drier for semiconductor material
JPS629635A (ja) * 1985-07-08 1987-01-17 Oki Electric Ind Co Ltd 半導体ウエハの回転乾燥装置
US4777732A (en) * 1986-06-12 1988-10-18 Oki Electric Industry Co., Ltd. Wafer centrifugal drying apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61179741U (ja) * 1985-04-25 1986-11-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011209283A (ja) * 2011-03-11 2011-10-20 Dainippon Printing Co Ltd 力学量センサ及びその製造方法

Also Published As

Publication number Publication date
US4907349A (en) 1990-03-13
DE3821067A1 (de) 1989-01-05
JPH069499Y2 (ja) 1994-03-09
KR890001158A (ko) 1989-03-18
KR950012659B1 (ko) 1995-10-19

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