JPS6421995A - Semiconductor module - Google Patents

Semiconductor module

Info

Publication number
JPS6421995A
JPS6421995A JP17826487A JP17826487A JPS6421995A JP S6421995 A JPS6421995 A JP S6421995A JP 17826487 A JP17826487 A JP 17826487A JP 17826487 A JP17826487 A JP 17826487A JP S6421995 A JPS6421995 A JP S6421995A
Authority
JP
Japan
Prior art keywords
resin
leads
external
printed board
semiconductor devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17826487A
Other languages
Japanese (ja)
Inventor
Hirofumi Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP17826487A priority Critical patent/JPS6421995A/en
Publication of JPS6421995A publication Critical patent/JPS6421995A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent short-circuit between external leads of first and second semiconductor devices by securing insulating resin on the opposing faces of the leads so that they are not contacted with each other. CONSTITUTION:In a semiconductor module having first and second semiconductor devices 12 arranged on a printed board 12, insulating resin 15, 17 is secured on the opposing faces of external leads 13 of the first and second semiconductor devices 11 for preventing short-circuit between them. For example, an identical resin 15 with the resin 14 used for sealing the body is applied on the external face of the leads 11 of an SOJ which is a surface packaged device. This resin 15 is molded simultaneously with the sealing of the SOJ by providing recesses in the upper halt of a sealing mold. The surface packaged device 11 is mounted on the printed board 12, such that the external contact face 19 of the device vertical to the printed board 12 is contacted with resin 17 adhered on the leads 13 of another device.
JP17826487A 1987-07-16 1987-07-16 Semiconductor module Pending JPS6421995A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17826487A JPS6421995A (en) 1987-07-16 1987-07-16 Semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17826487A JPS6421995A (en) 1987-07-16 1987-07-16 Semiconductor module

Publications (1)

Publication Number Publication Date
JPS6421995A true JPS6421995A (en) 1989-01-25

Family

ID=16045448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17826487A Pending JPS6421995A (en) 1987-07-16 1987-07-16 Semiconductor module

Country Status (1)

Country Link
JP (1) JPS6421995A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6054340A (en) * 1983-08-04 1985-03-28 ソシエテ　アノニム　ルウル　ベルトランデユポン Manufacture of substituted benzoic acid ester compound

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6054340A (en) * 1983-08-04 1985-03-28 ソシエテ　アノニム　ルウル　ベルトランデユポン Manufacture of substituted benzoic acid ester compound

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