JPS6419723A - Production device for semiconductor - Google Patents

Production device for semiconductor

Info

Publication number
JPS6419723A
JPS6419723A JP62176801A JP17680187A JPS6419723A JP S6419723 A JPS6419723 A JP S6419723A JP 62176801 A JP62176801 A JP 62176801A JP 17680187 A JP17680187 A JP 17680187A JP S6419723 A JPS6419723 A JP S6419723A
Authority
JP
Japan
Prior art keywords
wafer
magnification error
reduction magnification
temperature regulator
controller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62176801A
Other languages
Japanese (ja)
Inventor
Toshiki Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Original Assignee
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Semiconductor Manufacturing Co Ltd, Kansai Nippon Electric Co Ltd filed Critical Renesas Semiconductor Manufacturing Co Ltd
Priority to JP62176801A priority Critical patent/JPS6419723A/en
Publication of JPS6419723A publication Critical patent/JPS6419723A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To correct the reduction magnification error of an optical lens system by heating or cooling a wafer by a temperature regulator annexed to a chuck installed onto a moving stage and expanding or contracting the wafer. CONSTITUTION:When a reference mark 15 and an alignment mark 21 do not coincide by a reduction magnification error by an optical lens system 18, the reduction magnification error is read by cameras 22, 23 or laser interferometers 13, 14, the detecting signals are transmitted over a controller 24, and a control signal is sent to a temperature regulator 25 from said controller 24 on the basis of the detecting signals. A wafer 17 on a chuck 16 and a wafer 17' on a pre-alignment stage 26 are heated or cooled in response to said reduction magnification error by the temperature regulator 25.
JP62176801A 1987-07-14 1987-07-14 Production device for semiconductor Pending JPS6419723A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62176801A JPS6419723A (en) 1987-07-14 1987-07-14 Production device for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62176801A JPS6419723A (en) 1987-07-14 1987-07-14 Production device for semiconductor

Publications (1)

Publication Number Publication Date
JPS6419723A true JPS6419723A (en) 1989-01-23

Family

ID=16020080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62176801A Pending JPS6419723A (en) 1987-07-14 1987-07-14 Production device for semiconductor

Country Status (1)

Country Link
JP (1) JPS6419723A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0511847A2 (en) * 1991-05-01 1992-11-04 Canon Kabushiki Kaisha Length-measuring device and exposure apparatus
WO2002069393A1 (en) * 2001-02-24 2002-09-06 Jiwoo Techniques Korea Device for detecting wafer positioning failure on semiconductor processing device and method thereof
WO2018065222A1 (en) * 2016-10-07 2018-04-12 Asml Netherlands B.V. Lithographic apparatus and method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0511847A2 (en) * 1991-05-01 1992-11-04 Canon Kabushiki Kaisha Length-measuring device and exposure apparatus
WO2002069393A1 (en) * 2001-02-24 2002-09-06 Jiwoo Techniques Korea Device for detecting wafer positioning failure on semiconductor processing device and method thereof
WO2018065222A1 (en) * 2016-10-07 2018-04-12 Asml Netherlands B.V. Lithographic apparatus and method
US10775707B2 (en) 2016-10-07 2020-09-15 Asml Netherlands B.V. Lithographic apparatus and method

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