JPS6418779U - - Google Patents

Info

Publication number
JPS6418779U
JPS6418779U JP11437087U JP11437087U JPS6418779U JP S6418779 U JPS6418779 U JP S6418779U JP 11437087 U JP11437087 U JP 11437087U JP 11437087 U JP11437087 U JP 11437087U JP S6418779 U JPS6418779 U JP S6418779U
Authority
JP
Japan
Prior art keywords
circuit pattern
integrally formed
board
substrate part
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11437087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11437087U priority Critical patent/JPS6418779U/ja
Publication of JPS6418779U publication Critical patent/JPS6418779U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案のプリント回路基板の一実施
例を示す一部を切欠断面によつて示した斜視図、
第2図はその射出成形装置における射出成形金型
の断面図、第3図はその型締時における要部断面
図、第4図はスライド型の平面図である。 10……プリント回路基板、11……基板部、
13……回路パターン、14……端子金具、15
……接続部、16……通電部、21……固定型、
22……ピン、23……キヤビテイ、31……可
動型、40……キヤリアシート、41……回路パ
ターン、50……スライド型。
FIG. 1 is a partially cutaway perspective view showing an embodiment of the printed circuit board of this invention;
FIG. 2 is a cross-sectional view of the injection mold in the injection molding apparatus, FIG. 3 is a cross-sectional view of the main part during clamping, and FIG. 4 is a plan view of the slide mold. 10... Printed circuit board, 11... Board part,
13...Circuit pattern, 14...Terminal fitting, 15
... Connection part, 16 ... Current-carrying part, 21 ... Fixed type,
22... Pin, 23... Cavity, 31... Movable type, 40... Carrier sheet, 41... Circuit pattern, 50... Slide type.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板部の射出成形時にその表面側に回路パター
ンを一体に形成するとともに前記回路パターンと
接続する端子金具を備えた接続部を前記基板部と
一体に形成したことを特徴とするプリント回路基
板。
A printed circuit board, characterized in that a circuit pattern is integrally formed on the surface side of the substrate part during injection molding of the substrate part, and a connecting part provided with a terminal fitting to be connected to the circuit pattern is integrally formed with the board part.
JP11437087U 1987-07-24 1987-07-24 Pending JPS6418779U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11437087U JPS6418779U (en) 1987-07-24 1987-07-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11437087U JPS6418779U (en) 1987-07-24 1987-07-24

Publications (1)

Publication Number Publication Date
JPS6418779U true JPS6418779U (en) 1989-01-30

Family

ID=31355052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11437087U Pending JPS6418779U (en) 1987-07-24 1987-07-24

Country Status (1)

Country Link
JP (1) JPS6418779U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01228190A (en) * 1988-03-08 1989-09-12 Hokuriku Denki Kogyo Kk Circuit board
JPH07288369A (en) * 1994-12-05 1995-10-31 Hokuriku Electric Ind Co Ltd Circuit board and its manufacturing method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52126756A (en) * 1976-04-16 1977-10-24 Matsushita Electric Ind Co Ltd Inserttmolding method of preparing electroconductive plate for mounting electronic parts
JPS6232686A (en) * 1985-08-06 1987-02-12 キヤノン株式会社 Manufacture of molding with conductor layer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52126756A (en) * 1976-04-16 1977-10-24 Matsushita Electric Ind Co Ltd Inserttmolding method of preparing electroconductive plate for mounting electronic parts
JPS6232686A (en) * 1985-08-06 1987-02-12 キヤノン株式会社 Manufacture of molding with conductor layer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01228190A (en) * 1988-03-08 1989-09-12 Hokuriku Denki Kogyo Kk Circuit board
JPH07288369A (en) * 1994-12-05 1995-10-31 Hokuriku Electric Ind Co Ltd Circuit board and its manufacturing method

Similar Documents

Publication Publication Date Title
JPS6418779U (en)
JPH0262721U (en)
JPH01121966U (en)
JPS62191190U (en)
JPS63170969U (en)
JPH0481365U (en)
JPS6420770U (en)
JPS62119582U (en)
JPH0379913U (en)
JPH0170351U (en)
JPS6343363U (en)
JPS63137469U (en)
JPH01121265U (en)
JPH01140770U (en)
JPH02138457U (en)
JPH0450211U (en)
JPS62104453U (en)
JPH01179366U (en)
JPS63112731U (en)
JPH0459089U (en)
JPS63129981U (en)
JPH03109393U (en)
JPS6327071U (en)
JPS6281335U (en)
JPS63186053U (en)