JPS6418735U - - Google Patents
Info
- Publication number
- JPS6418735U JPS6418735U JP1987113077U JP11307787U JPS6418735U JP S6418735 U JPS6418735 U JP S6418735U JP 1987113077 U JP1987113077 U JP 1987113077U JP 11307787 U JP11307787 U JP 11307787U JP S6418735 U JPS6418735 U JP S6418735U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- light
- heated
- light source
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0711—
-
- H10W72/07141—
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- H10W72/07173—
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- H10W72/075—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987113077U JPS6418735U (enExample) | 1987-07-23 | 1987-07-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987113077U JPS6418735U (enExample) | 1987-07-23 | 1987-07-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6418735U true JPS6418735U (enExample) | 1989-01-30 |
Family
ID=31352597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987113077U Pending JPS6418735U (enExample) | 1987-07-23 | 1987-07-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6418735U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8235503B2 (en) | 2007-12-20 | 2012-08-07 | Canon Kabushiki Kaisha | Semiconductor element chip, ink jet head employing semiconductor element chip, and method for bonding electrodes of semiconductor element chip |
-
1987
- 1987-07-23 JP JP1987113077U patent/JPS6418735U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8235503B2 (en) | 2007-12-20 | 2012-08-07 | Canon Kabushiki Kaisha | Semiconductor element chip, ink jet head employing semiconductor element chip, and method for bonding electrodes of semiconductor element chip |