JPS641789Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a holding structure for an ultrasonic solid state retarder.

Conventionally, as shown in FIG. 1, as shown in FIG. A metal wire 4 is passed through and fixed inside.
Note that 5 is a case that fits into the side surface of the insulating base 1.

According to this holding structure, since the delay medium 2 is held between the holding columns 3 through both main surfaces thereof, it is possible to hold the delay medium 2 in a fairly stable state. Since they are arranged in rows, there is a drawback that the width W of the insulating base 1 becomes large. Furthermore, it could not necessarily be said to be strong against vibrations and shocks from the outside.

The first purpose of the present invention is to provide an ultrasonic solid state retarder with a reduced width dimension (or height dimension depending on the installation orientation), and the second purpose is to It is an object of the present invention to provide an ultrasonic solid state retarder that is robust against.

In order to achieve this purpose, the present invention
An input transducer and an output transducer are installed on the sides of a delay medium, and the ultrasonic wave emitted from the input transducer propagates along a predetermined propagation path within the delay medium and reaches the output transducer, and the ultrasonic wave is Printed wiring of an insulating substrate on which an ultrasonic absorber is attached on the main surface of the delay medium in an area other than the predetermined propagation path of the sound wave, and each lead wire of the input transducer and the output transducer is printed. This is a holding structure for an ultrasonic solid state retarder, which is connected to the end portion and wraps the retardation medium and the insulating substrate with a heat-shrinkable tube.

2, 3 and 4 show an embodiment of the present invention. First, FIG. 2 shows the main body of the delay element used in the present invention. The delay medium 6 is made of fused silica and has a pentagonal shape with one corner of a rectangle with a side ratio of 3:2 cut out at an angle of 45°.
An input transducer 7 and an output transducer 8 are installed on the cutout surface. Input converter 7 has lead wires 71 and 7
2, a predetermined input signal is obtained and converted into an ultrasonic signal, which is repeatedly reflected on each side along the propagation path 9 as shown by the broken line, and reaches the output transducer 8, which outputs the ultrasonic signal. Output signals are obtained from lead wires 81 and 82 of 8. A so-called multi-reflection type retarder, which obtains a delay time by repeating reflections on each side, tends to generate spurious waves because the ultrasonic waves propagate through paths other than the propagation path 9 and are reflected at each side. There is an ultrasonic absorber such as epoxy resin10 as a means to suppress the spurious.
is attached on the main surface in areas other than the predetermined propagation path 9. With this ultrasonic absorber 10, the delay element of this example can suppress spurious up to 26 to 32 dB.

FIG. 3 is a perspective view showing the assembly of an ultrasonic solid state retarder according to an embodiment of the present invention, and the retardator body is the same as that shown in FIG. 2. Insulating substrate 11
is molded from phenolic resin or epoxy resin, and its shape is similar to that of the input/output converter 7 of the delay medium 6.
It has a pentagonal shape with a 45° cutout surface 12 corresponding to the installation surface of the delay medium 6, and is almost similar in shape to the delay medium 6.

On the main surface of this insulating substrate 6, printed wirings 161, 162, 16 made of a metal film such as copper are provided.
3 and 164 are provided, and one end of these printed wirings is a terminal portion 131, 132, 133, 134 having a small semicircle at a position in contact with the notch surface 12, and these terminal portions 131, 132, 133, 1
Lead wires 71 and 7 of input transducer 7 are connected to 34 respectively.
2 and the lead wires 81 and 82 of the output converter 8 are electrically connected by soldering etc., and the printed wiring 1
The other ends of metal wires 141, 142, 14 serve as external terminals, respectively.
Insertion part 15 where 3,144 was inserted and electrically connected
1,152,153,154.

The main surface of the delay medium 6 to which the ultrasonic absorber 10 is attached is made to face the main surface of the insulating substrate 11, and an adhesive 1 such as epoxy resin is applied only to the ultrasonic absorber 10.
3 to fix the delay medium 6 to the insulating substrate 11. FIG. 4 shows a side view of the ultrasonic solid state retarder fixed by adhesive 13, and the electrical connection of the lead wires described above is made after this fixation. Note that the cover 14 indicated by a broken line in FIG.
81, 82, input/output converters 7, 8, and insulating substrate 11
Protect by enveloping.

The ultrasonic solid retardator thus constructed has a height dimension H equal to the thickness of the retardation medium 6 (this example: 0.8 mm).
Thickness of ultrasonic absorber 10 and adhesive 13 (same: 0.5
mm) and the thickness of the insulating substrate 11 (1 mm).
Since the delay medium is fixed to the insulating substrate 11 via the adhesive 13 attached to the ultrasonic absorbers 10 scattered on its main surface, it is firmly held and is protected from external vibrations and shocks. can withstand enough. Furthermore, since no special structure is used as the holding structure, manufacturing costs can be reduced. Furthermore, although it was not initially expected, the spurious suppression means using only the ultrasonic absorber 10 caused considerable variation in the spurious effect.
According to the present invention, a uniform spurious effect can be obtained. Furthermore, the installation surface of the input/output converters 7 and 8 of the delay medium 6 and the terminal portion 13 of the insulating substrate 11
Since the surfaces of 1, 132, 133, and 134 are similar in shape, the lead wires 7 of the input/output converters 7 and 8
1, 72, 81, 82 terminal parts 131, 132,
The electrical connection work to 133 and 134 can be facilitated.

5, 6 and 7 show another embodiment of the present invention, in which delay media 6 and 19 are held on both main surfaces of an insulating substrate 18, respectively.

In FIG. 5, the main body of the delay element located on the left side with the insulating substrate 18 in between is the same as that shown in FIG. The shape of the insulating substrate 18 is made to correspond to each shape and each installation direction of the delay media 6 and 19, and in particular, to be similar to the shape of the delay media 6 and 19 on the installation surface of the input/output converters 7, 8 and 27, 28. It is a hexagonal shape with 45° cutout surfaces 20 and 21 formed at the two corners of the rectangle. Then, printed wirings 221, 222, 22 are provided on the main surface of the insulating substrate 18 on one side (on the delay medium 19 side) adjacent to the notch surface 20.
3, 224, and the terminal parts 231, 232, 233, 234, which are one ends of these printed wirings, touch the notch surface 20 with a small semicircle, and here, the lead wires 71, 224 of the input/output converters 7, 8 72, 81,
82 are electrically connected to each other. At the other ends of these printed wirings 221, 222, 223, 224,
Insertion parts 251, 252, 253, 254 for inserting and connecting external terminals 241, 242, 243, 244
is provided.

The delay medium 19 is arranged in a direction in which the delay medium 6 is rotated by 180 degrees in the drawing, and an ultrasonic absorber 26 is placed on the main surface facing the insulating substrate 18, similar to the ultrasonic absorber 10 of the delay medium 6. is attached to. In addition, the other side (delay medium 6
Similarly, the printed wiring 291, 292, 293, 294 provided on the main surface of the insulating substrate 18 (side)
Terminal portions 301, 302, 303, 30 provided at one end thereof at a position in contact with the notch surface 21
Lead wires 271, 272, 281, 282 of the input/output converters 27, 28 are electrically connected to the terminals 4, and the other ends thereof are connected with the insertion portions 253, 2, respectively.
54, 255, 256 are provided, and the external terminal 24
2,241,245,246 are inserted and connected. Note that the external terminal 242 is connected to the printed wiring 222.
291, external terminal 241 is printed wiring 221
and 292 are connected in common.

Then, as shown in FIG. 6, delay media 6 and 19
adhesive 31 to the ultrasonic absorbers 10 and 26, respectively.
and 32 to fix both delay media 6 and 19 to the insulating substrate 18. After this fixation, the aforementioned lead wires are connected, and the cover 15 is placed on top. FIG. 7 shows the electrical connections of the delay element of this example.

The above embodiment is particularly useful when doubling the delay time of an individual delay body, e.g.
It is suitable for providing a delay element with a delay time of 2H by cascading two delay element bodies with a delay time of 1H (≈63μs). These embodiments also have the same effects as the embodiments shown in FIGS. 2 to 4.

The present invention has been described above with reference to examples, but the shapes of the delay medium and insulating substrate are not limited to those of the example, and other multi-reflection type delay media and insulating substrates with corresponding shapes may be used. It may be hot.

[Brief explanation of the drawing]

Fig. 1 is a diagram showing the holding structure of a conventional ultrasonic solid-state retarder, Fig. 2 is a diagram showing an embodiment of the retarder main body used in the present invention, and Fig. 3 is a diagram showing an embodiment of the retarder body used in the present invention. Diagram 4 showing the assembly of the ultrasonic solid state retarder
The figure shows the state after the assembly shown in FIG. 3, FIG. 5 shows the assembly of an ultrasonic solid state retarder according to another embodiment of the present invention, and FIG. 6 shows the state after the assembly shown in FIG. FIG. 7 is a diagram showing electrical connections of the delay elements shown in FIGS. 5 and 6. 6, 19... Delay medium, 7, 27... Input transducer, 8, 28... Output transducer, 9... Propagation path,
10, 26... Ultrasonic absorber, 11, 18... Insulating substrate, 13, 31, 32... Adhesive.

Claims (1)

[Scope of utility model registration request] An input transducer and an output transducer are installed on the sides of a delay medium, and the ultrasonic wave emitted from the input transducer propagates along a predetermined propagation path within the delay medium and reaches the output transducer, and the ultrasonic wave is Printed wiring of an insulating substrate on which an ultrasonic absorber is attached on the main surface of the delay medium in an area other than the predetermined propagation path of the sound wave, and each lead wire of the input transducer and the output transducer is printed. 1. A holding structure for an ultrasonic solid retardator, characterized in that the retardation medium and the insulating substrate are wrapped in a heat-shrinkable tube connected to an end thereof.