JPS6416641U - - Google Patents
Info
- Publication number
- JPS6416641U JPS6416641U JP1987111807U JP11180787U JPS6416641U JP S6416641 U JPS6416641 U JP S6416641U JP 1987111807 U JP1987111807 U JP 1987111807U JP 11180787 U JP11180787 U JP 11180787U JP S6416641 U JPS6416641 U JP S6416641U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- chip
- wiring board
- semiconductor chip
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000003566 sealing material Substances 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims 1
- 239000002470 thermal conductor Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987111807U JPH041738Y2 (US20020051482A1-20020502-M00012.png) | 1987-07-20 | 1987-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987111807U JPH041738Y2 (US20020051482A1-20020502-M00012.png) | 1987-07-20 | 1987-07-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6416641U true JPS6416641U (US20020051482A1-20020502-M00012.png) | 1989-01-27 |
| JPH041738Y2 JPH041738Y2 (US20020051482A1-20020502-M00012.png) | 1992-01-21 |
Family
ID=31350183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987111807U Expired JPH041738Y2 (US20020051482A1-20020502-M00012.png) | 1987-07-20 | 1987-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH041738Y2 (US20020051482A1-20020502-M00012.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH075801U (ja) * | 1993-06-22 | 1995-01-27 | 将一 林 | 自動車用ホイールのセンターロツク装置 |
| JP2008047908A (ja) * | 2006-08-14 | 2008-02-28 | Chien-Chung Chen | 発光モジュールおよびその製造プロセス |
-
1987
- 1987-07-20 JP JP1987111807U patent/JPH041738Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH075801U (ja) * | 1993-06-22 | 1995-01-27 | 将一 林 | 自動車用ホイールのセンターロツク装置 |
| JP2008047908A (ja) * | 2006-08-14 | 2008-02-28 | Chien-Chung Chen | 発光モジュールおよびその製造プロセス |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH041738Y2 (US20020051482A1-20020502-M00012.png) | 1992-01-21 |
