JPS6415941A - Wire bonder - Google Patents

Wire bonder

Info

Publication number
JPS6415941A
JPS6415941A JP62171189A JP17118987A JPS6415941A JP S6415941 A JPS6415941 A JP S6415941A JP 62171189 A JP62171189 A JP 62171189A JP 17118987 A JP17118987 A JP 17118987A JP S6415941 A JPS6415941 A JP S6415941A
Authority
JP
Japan
Prior art keywords
wire
operator
inclined plane
anvil
hold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62171189A
Other languages
Japanese (ja)
Inventor
Nariyuki Uenishikubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP62171189A priority Critical patent/JPS6415941A/en
Publication of JPS6415941A publication Critical patent/JPS6415941A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To improve workability, to shorten the stopping time of a device and to enhance productivity by obliquely arranging the direction of a wire hold-down plate toward a surface directly opposite to an operator. CONSTITUTION:Wire hold-down plates 3 and 2 are fixed respectively onto the inclined plane of an anvil 10 fastened to a base section 5 for a main body 4 and the inclined plane of a lever 7 bent in parallel with the inclined plane of the anvil. A solenoid 11 for opening is used in place of a cam 8 for displacement. When a wire 1 is cut during the operation of an automatic wire bonder, an operator can insert the wire 1 easily by using tweezes into a capillary from a section between the wire hold-down plates 2 and 3 opened to the right from a surface directly opposite to the operator as the operator is under an attitude of viewing a microscope for work.
JP62171189A 1987-07-10 1987-07-10 Wire bonder Pending JPS6415941A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62171189A JPS6415941A (en) 1987-07-10 1987-07-10 Wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62171189A JPS6415941A (en) 1987-07-10 1987-07-10 Wire bonder

Publications (1)

Publication Number Publication Date
JPS6415941A true JPS6415941A (en) 1989-01-19

Family

ID=15918655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62171189A Pending JPS6415941A (en) 1987-07-10 1987-07-10 Wire bonder

Country Status (1)

Country Link
JP (1) JPS6415941A (en)

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