JPS6413768A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS6413768A JPS6413768A JP62170213A JP17021387A JPS6413768A JP S6413768 A JPS6413768 A JP S6413768A JP 62170213 A JP62170213 A JP 62170213A JP 17021387 A JP17021387 A JP 17021387A JP S6413768 A JPS6413768 A JP S6413768A
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- semiconductor chips
- metallic
- insulating film
- signal processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:To obtain one-dimensional infrared sensor, in which a metallic bump is not deformed plastically even when a semiconductor device is exposed to temperature cycles at the time of operation and the time of non-operation and which has a large number of picture elements, by connecting a signal output section for an infrared detecting element to a wiring pattern formed to an insulating substrate by the metallic bumps while connecting a signal input section for a signal processing circuit and the wiring pattern by a metallic column. CONSTITUTION:A specified wiring pattern 22 coated with an insulating film 23 is shaped onto an insulating substrate 21, and first semiconductor chips 24 to which one-dimensional infrared detecting elements 25 are formed are disposed zigzag onto the wiring pattern 22. Signal output sections for the detecting elements 25 are connected at one ends of said wiring pattern 22 by metallic bumps 26, 27 through opening sections shaped to the insulating film 23. Second semiconductor chips 28 to which signal processing circuits are formed are arranged zigzag correspondingly to the array of the semiconductor chips 24 on both sides of the semiconductor chips 24. Signal input sections for the signal processing circuits are connected at the other ends of the wiring pattern by metallic bumps 29, 30 through the opening sections shaped to the insulating film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62170213A JPH0828488B2 (en) | 1987-07-07 | 1987-07-07 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62170213A JPH0828488B2 (en) | 1987-07-07 | 1987-07-07 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6413768A true JPS6413768A (en) | 1989-01-18 |
JPH0828488B2 JPH0828488B2 (en) | 1996-03-21 |
Family
ID=15900767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62170213A Expired - Fee Related JPH0828488B2 (en) | 1987-07-07 | 1987-07-07 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0828488B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020121852A1 (en) * | 2018-12-12 | 2020-06-18 | 浜松ホトニクス株式会社 | Photodetector |
US11513002B2 (en) | 2018-12-12 | 2022-11-29 | Hamamatsu Photonics K.K. | Light detection device having temperature compensated gain in avalanche photodiode |
US11561131B2 (en) | 2018-12-12 | 2023-01-24 | Hamamatsu Photonics K.K. | Determination method and light detection device |
-
1987
- 1987-07-07 JP JP62170213A patent/JPH0828488B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020121852A1 (en) * | 2018-12-12 | 2020-06-18 | 浜松ホトニクス株式会社 | Photodetector |
US11513002B2 (en) | 2018-12-12 | 2022-11-29 | Hamamatsu Photonics K.K. | Light detection device having temperature compensated gain in avalanche photodiode |
US11561131B2 (en) | 2018-12-12 | 2023-01-24 | Hamamatsu Photonics K.K. | Determination method and light detection device |
US11901379B2 (en) | 2018-12-12 | 2024-02-13 | Hamamatsu Photonics K.K. | Photodetector |
US11927478B2 (en) | 2018-12-12 | 2024-03-12 | Hamamatsu Photonics K.K. | Light detection device |
Also Published As
Publication number | Publication date |
---|---|
JPH0828488B2 (en) | 1996-03-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |