JPS6413156U - - Google Patents

Info

Publication number

JPS6413156U

JPS6413156U JP10607887U JP10607887U JPS6413156U JP S6413156 U JPS6413156 U JP S6413156U JP 10607887 U JP10607887 U JP 10607887U JP 10607887 U JP10607887 U JP 10607887U JP S6413156 U JPS6413156 U JP S6413156U

Authority

JP

Japan

Prior art keywords

integrated circuit

hybrid integrated

heat

circuit board

substrate

Prior art date

1987-07-10

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000758 substrate Substances 0.000 claims description 4
• 239000004020 conductor Substances 0.000 claims description 3
• 230000017525 heat dissipation Effects 0.000 claims description 3
• 230000000712 assembly Effects 0.000 claims description 2
• 238000000429 assembly Methods 0.000 claims description 2
• 239000000463 material Substances 0.000 claims 2
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 239000000919 ceramic Substances 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1
• 230000020169 heat generation Effects 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1
• 229920001187 thermosetting polymer Polymers 0.000 description 1