JPS6413148U - - Google Patents
Info
- Publication number
- JPS6413148U JPS6413148U JP10668087U JP10668087U JPS6413148U JP S6413148 U JPS6413148 U JP S6413148U JP 10668087 U JP10668087 U JP 10668087U JP 10668087 U JP10668087 U JP 10668087U JP S6413148 U JPS6413148 U JP S6413148U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- heat dissipation
- board
- substrate
- dissipation device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
図面は本願の実施例を示すもので、第1図は放
熱装置の斜視図、第2図は放熱装置の正面図、第
3図は放熱装置の分解斜視図、第4図は第1図の
−線断面図、第5図は異なる放熱装置を一部
破断して示す側面図、第6図は異なる基板の斜視
図。
1……基板、2……放熱板、3……取付脚、5
……止着片、8……半導体素子、8b……リード
、11……透孔、12……止着孔。
The drawings show an embodiment of the present application, and FIG. 1 is a perspective view of a heat radiating device, FIG. 2 is a front view of the heat radiating device, FIG. 3 is an exploded perspective view of the heat radiating device, and FIG. - line sectional view, FIG. 5 is a partially cutaway side view of a different heat dissipation device, and FIG. 6 is a perspective view of a different board. 1... Board, 2... Heat sink, 3... Mounting leg, 5
...Fixing piece, 8...Semiconductor element, 8b...Lead, 11...Through hole, 12...Fixing hole.
Claims (1)
した二つの側体部を備える放熱板を基板に立設し
て成る放熱装置において、上記夫々の側体部の下
方先端に設けられたL字状の取付脚は夫々上記基
板の端縁に引掛けてあり、上記主体部の下端から
突設された止着片は上記基板の止着孔に止着して
あり、更に上記主体部に固着された半導体素子の
リードは上記基板の透孔に貫通されていることを
特徴とする放熱装置。 In a heat dissipation device comprising a heat dissipation plate having a plate-shaped main body and two side body parts protruding from both sides of the main body, which are erected on a substrate, an L provided at the lower tip of each of the side body parts is provided. The letter-shaped mounting legs are each hooked on the edge of the board, and the fastening piece protruding from the bottom end of the main body is fixed to the fastening hole of the board, and is further hooked onto the main body. A heat dissipation device characterized in that the leads of the fixed semiconductor element are passed through the through holes of the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10668087U JPS6413148U (en) | 1987-07-11 | 1987-07-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10668087U JPS6413148U (en) | 1987-07-11 | 1987-07-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6413148U true JPS6413148U (en) | 1989-01-24 |
Family
ID=31340407
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10668087U Pending JPS6413148U (en) | 1987-07-11 | 1987-07-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6413148U (en) |
-
1987
- 1987-07-11 JP JP10668087U patent/JPS6413148U/ja active Pending