JPS6398648U - - Google Patents

Info

Publication number
JPS6398648U
JPS6398648U JP19315386U JP19315386U JPS6398648U JP S6398648 U JPS6398648 U JP S6398648U JP 19315386 U JP19315386 U JP 19315386U JP 19315386 U JP19315386 U JP 19315386U JP S6398648 U JPS6398648 U JP S6398648U
Authority
JP
Japan
Prior art keywords
tab
leads
lead
extending
dam part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19315386U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19315386U priority Critical patent/JPS6398648U/ja
Publication of JPS6398648U publication Critical patent/JPS6398648U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａはこの考案の一実施例を示す平面図、
第１図ｂは本考案のリードフレームを用いて組み
立てた半導体装置の一例を示す説明図、第２図は
従来のリードフレームの構造を示す平面図である
。 １……半導体チツプ、２……銀ペースト、３…
…タブ、４……タブリード、５１，５２……リー
ド、６……ダム部、７……金線、８……ダミーリ
ード、９……モールド樹脂。 Figure 1a is a plan view showing an embodiment of this invention;
FIG. 1B is an explanatory view showing an example of a semiconductor device assembled using the lead frame of the present invention, and FIG. 2 is a plan view showing the structure of a conventional lead frame. 1...Semiconductor chip, 2...Silver paste, 3...
...Tab, 4...Tab lead, 51, 52...Lead, 6...Dam part, 7...Gold wire, 8...Dummy lead, 9...Mold resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チツプを載置するタブと、該タブから延
びたリードと、該リードに平行で先端部が前記タ
ブに近接した複数のリードと、該複数のリードお
よび前記タブから延びたリードの中間部分を直角
に連結するダム部とを有するシングルインライン
型リードフレームにおいて、前記タブから延びた
リードの他に、前記タブと前記ダム部とを連結す
るリードを設けたことを特徴とするシングルイン
ライン型リードフレーム。 A tab on which a semiconductor chip is placed, a lead extending from the tab, a plurality of leads that are parallel to the lead and whose tips are close to the tab, and an intermediate portion between the plurality of leads and the leads extending from the tab. A single in-line type lead frame having a dam part connected at right angles, characterized in that, in addition to the leads extending from the tab, a lead connecting the tab and the dam part is provided. .
JP19315386U 1986-12-17 1986-12-17 Pending JPS6398648U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19315386U JPS6398648U (en) 1986-12-17 1986-12-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19315386U JPS6398648U (en) 1986-12-17 1986-12-17

Publications (1)

Publication Number Publication Date
JPS6398648U true JPS6398648U (en) 1988-06-25

Family

ID=31148913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19315386U Pending JPS6398648U (en) 1986-12-17 1986-12-17

Country Status (1)

Country Link
JP (1) JPS6398648U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56122154A (en) * 1980-02-28 1981-09-25 Mitsubishi Electric Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56122154A (en) * 1980-02-28 1981-09-25 Mitsubishi Electric Corp Semiconductor device

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