JPS6397245U - - Google Patents
Info
- Publication number
- JPS6397245U JPS6397245U JP19330786U JP19330786U JPS6397245U JP S6397245 U JPS6397245 U JP S6397245U JP 19330786 U JP19330786 U JP 19330786U JP 19330786 U JP19330786 U JP 19330786U JP S6397245 U JPS6397245 U JP S6397245U
- Authority
- JP
- Japan
- Prior art keywords
- sealing resin
- resin
- sealed
- lead terminal
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示す側面図である
。 １…封止樹脂、２…封止部、３…外部リード端
子、４…湾曲した折返し部。
。 １…封止樹脂、２…封止部、３…外部リード端
子、４…湾曲した折返し部。
Claims (1)
- 封止樹脂から導出される外部リード端子に前記
封止樹脂との封止部近傍において湾曲した折返し
部が設けられていることを特徴とする樹脂封止型
半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19330786U JPS6397245U (ja) | 1986-12-15 | 1986-12-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19330786U JPS6397245U (ja) | 1986-12-15 | 1986-12-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6397245U true JPS6397245U (ja) | 1988-06-23 |
Family
ID=31149211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19330786U Pending JPS6397245U (ja) | 1986-12-15 | 1986-12-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6397245U (ja) |
-
1986
- 1986-12-15 JP JP19330786U patent/JPS6397245U/ja active Pending