JPS6395691A - Semiconductor light-emitting device - Google Patents

Abstract

PURPOSE:To remove the defective assembly of a short circuit, etc., and to dissipate heat generation in a light-emitting section efficiently by bonding a semiconductor laser chip with a heat sink on the light-emitting section side main surface of the chip and on the reverse side main surface and mounting a radiator plate onto the light-emitting section side main surface, in contact with the surface of the heat sink. CONSTITUTION:The greater part of heat generated in a light-emitting section 2 pass through an upper ohmic electrode, and transmitted over a heat sink 3 through a radiator plate 4 consisting of a conductive material such as Mo, one part of residual heat escapes into air, and the other passes in a semiconductor laser chip 1 and flows through the heat sink 3 in a lower section, thus effectively dissipating the heat generation of the light-emitting section to the outside. A defective short-circuit on assembly can be removed by assembling the title device through a junction up method.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a semiconductor light emitting device, and particularly to improving its assembly ease and thermal characteristics.

[Conventional technology]

FIG. 3 shows a conventional semiconductor light emitting device, in which l
2 is a semiconductor laser chip, 2 is a light emitting part of the semiconductor laser chip 1, and 3 is a heat sink that receives heat generated by the light emitting part 2. Note that arrows indicate the flow of heat generated in the light emitting section 2. The semiconductor laser chip 1 is bonded by the junction down method so that the light emitting section 2 inside thereof is positioned below, that is, on the heat sink 3 side. 2. Description of the Related Art Conventionally, semiconductor light emitting devices have been provided with a heat sink for efficiently dissipating heat from a light emitting part to the outside so that the light output does not decrease due to the heat generated in the light emitting part.

The conventional semiconductor device is constructed as described above, and the heat generated in the light emitting part during operation is transmitted directly to the heat sink at the bottom, or is transmitted to the entire surface of the semiconductor laser chip l and then flows to the heat sink 3.

[Problem that the invention seeks to solve]

In the semiconductor light emitting device as described above, in order to improve the heat dissipation of the light emitting part, the light emitting part 2 is separated from the heat sink 3 by about several μm.
Since it is located very close to the
There was a problem in that the solder material etc. could wrap around and cause a short circuit.

This invention was made to solve the above-mentioned problems, and can eliminate short-circuit defects during assembly.
It is an object of the present invention to obtain a semiconductor light emitting device having good heat dissipation characteristics.

Means for Solving Problem C] In the semiconductor light emitting device according to the present invention, a semiconductor laser chip is bonded to a heat sink at its main surface opposite to the main surface on the light emitting part side, and a heat sink is attached to the semiconductor laser chip. It is provided in contact with the main surface on the light emitting section side and the heat sink surface.

[Effect]

In this invention, the semiconductor laser chip is bonded to the heat sink so that its light emitting part is located upward, and the heat sink is provided in contact with the main surface on the light emitting part side and the heat sink surface, so that short circuits may occur during assembly. This makes it possible to efficiently dissipate heat from the light emitting section.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a semiconductor light emitting device according to an embodiment of the present invention, in which l is a semiconductor laser chip, 2 is a light emitting part embedded in the semiconductor laser chip 1, and 3 is a light emitting part embedded in the light emitting part 2. A heat sink 4 that receives heat is a heat sink made of a conductive material such as MO for dissipating the heat generated in the light emitting section 2 to the heat sink 3. The semiconductor laser chip 1 is adhered to the heat sink 3 by the junk seal up method so that the light emitting part 2 is located above, and then the heat sink 4 is brought into contact with the upper principal surface of the semiconductor laser chip 1 and the heat sink 3. establish.

Next, the action and effect will be explained.

In a semiconductor light-emitting device assembled using the junction-up method, if a heat sink is not provided as in the conventional method, more than 50% of the heat generated in the light-emitting part will be transmitted through the electrodes on the top surface of the semiconductor chip and spread over the entire surface of the semiconductor chip. Analysis has confirmed that the energy is transmitted toward the bottom surface of the semiconductor chip and flows to the heat sink. In contrast, in this embodiment, most of the heat generated in the light emitting unit 2 during operation passes through the upper ohmic electrode, is transmitted to the heat sink 3 via the heat sink 4 made of a conductive material such as MO, and the remaining heat is transmitted to the heat sink 3 via the heat sink 4 made of a conductive material such as MO. A part of the heat escapes into the air, and the other part passes through the inside of the semiconductor laser chip 1 and flows to the heat sink 3 below. In this way, the heat generated by the light emitting part can be effectively dissipated to the outside. .

Further, in this embodiment, by assembling by the junction-up method, short circuit failures during assembly can be eliminated.

In addition, in the above example, MO was used for the heat sink, but
Other conductive materials having a thermal expansion coefficient similar to that of the semiconductor chip and good thermal conductivity may be used.

Further, as shown in FIG. 2, the heat sink may be brought into contact with only one side of the heat sink.

Further, although the above embodiments were applicable to semiconductor lasers, similar effects can be obtained with other edge emitting devices.

〔Effect of the invention〕

As described above, according to the semiconductor light emitting device of the present invention, the semiconductor laser chip is bonded to the heat sink at its main surface opposite to the main surface on the light emitting section side, and the main surface on the light emitting section side is in contact with the heat sink surface. Since the heat dissipation plate is provided, it is possible to eliminate assembly defects such as short circuits and to efficiently dissipate heat generated in the light emitting section.

[Brief explanation of the drawing]

FIG. 1 is an assembly diagram of a semiconductor light emitting device according to one embodiment of the present invention, FIG. 2 is an assembly diagram of a semiconductor light emitting device according to another embodiment of the invention, and FIG. 4 is an assembly diagram of a conventional semiconductor light emitting device. be. In the figure, 1 is a semiconductor laser chip, 2 is a light emitting part, and 3 is a semiconductor laser chip.
is a heat sink, and 4 is a heat sink. In the drawings, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] (1) In a semiconductor light emitting device consisting of a semiconductor laser chip and a heat sink, the semiconductor laser chip is adhered to the heat sink with its main surface opposite to the main surface on the light emitting part side, and the light emitting part side of the semiconductor laser chip is bonded to the heat sink. A semiconductor light emitting device characterized in that a heat sink is provided on a main surface in contact with the heat sink.