JPS6393885A - プリント基板端子のメツキ防止用テ−プ貼り付け装置 - Google Patents

プリント基板端子のメツキ防止用テ−プ貼り付け装置

Info

Publication number
JPS6393885A
JPS6393885A JP23618886A JP23618886A JPS6393885A JP S6393885 A JPS6393885 A JP S6393885A JP 23618886 A JP23618886 A JP 23618886A JP 23618886 A JP23618886 A JP 23618886A JP S6393885 A JPS6393885 A JP S6393885A
Authority
JP
Japan
Prior art keywords
tape
printed circuit
circuit board
tilting plate
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23618886A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0419317B2 (enrdf_load_stackoverflow
Inventor
Hitoshi Motosugi
本杉　仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Takeuchi Manufacturing Co Ltd
Original Assignee
Takeuchi Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takeuchi Manufacturing Co Ltd filed Critical Takeuchi Manufacturing Co Ltd
Priority to JP23618886A priority Critical patent/JPS6393885A/ja
Publication of JPS6393885A publication Critical patent/JPS6393885A/ja
Publication of JPH0419317B2 publication Critical patent/JPH0419317B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
JP23618886A 1986-10-06 1986-10-06 プリント基板端子のメツキ防止用テ−プ貼り付け装置 Granted JPS6393885A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23618886A JPS6393885A (ja) 1986-10-06 1986-10-06 プリント基板端子のメツキ防止用テ−プ貼り付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23618886A JPS6393885A (ja) 1986-10-06 1986-10-06 プリント基板端子のメツキ防止用テ−プ貼り付け装置

Publications (2)

Publication Number Publication Date
JPS6393885A true JPS6393885A (ja) 1988-04-25
JPH0419317B2 JPH0419317B2 (enrdf_load_stackoverflow) 1992-03-30

Family

ID=16997078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23618886A Granted JPS6393885A (ja) 1986-10-06 1986-10-06 プリント基板端子のメツキ防止用テ−プ貼り付け装置

Country Status (1)

Country Link
JP (1) JPS6393885A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0419317B2 (enrdf_load_stackoverflow) 1992-03-30

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