JPS639374B2 - - Google Patents

Info

Publication number
JPS639374B2
JPS639374B2 JP58081389A JP8138983A JPS639374B2 JP S639374 B2 JPS639374 B2 JP S639374B2 JP 58081389 A JP58081389 A JP 58081389A JP 8138983 A JP8138983 A JP 8138983A JP S639374 B2 JPS639374 B2 JP S639374B2
Authority
JP
Japan
Prior art keywords
roll
pellet
tape
pick
pellets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58081389A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59205733A (ja
Inventor
Takeshi Sato
Masahiro Muraoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP8138983A priority Critical patent/JPS59205733A/ja
Publication of JPS59205733A publication Critical patent/JPS59205733A/ja
Publication of JPS639374B2 publication Critical patent/JPS639374B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP8138983A 1983-05-09 1983-05-09 ペレットピックアップ装置 Granted JPS59205733A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8138983A JPS59205733A (ja) 1983-05-09 1983-05-09 ペレットピックアップ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8138983A JPS59205733A (ja) 1983-05-09 1983-05-09 ペレットピックアップ装置

Publications (2)

Publication Number Publication Date
JPS59205733A JPS59205733A (ja) 1984-11-21
JPS639374B2 true JPS639374B2 (enrdf_load_stackoverflow) 1988-02-29

Family

ID=13744943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8138983A Granted JPS59205733A (ja) 1983-05-09 1983-05-09 ペレットピックアップ装置

Country Status (1)

Country Link
JP (1) JPS59205733A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3745260B2 (ja) 2001-10-02 2006-02-15 ローム株式会社 半導体装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5366159A (en) * 1976-11-26 1978-06-13 Toshiba Corp Production unit of semiconductor element
JPS607487Y2 (ja) * 1980-06-12 1985-03-13 日本電気ホームエレクトロニクス株式会社 ペレツト剥離装置

Also Published As

Publication number Publication date
JPS59205733A (ja) 1984-11-21

Similar Documents

Publication Publication Date Title
US4881319A (en) Process for mounting chip type circuit elements on printed circuit boards and apparatus therefor
JP7664149B2 (ja) 半導体デバイスの転写方法
KR102411519B1 (ko) 반도체 제조 장치 및 반도체 장치의 제조 방법
KR102785758B1 (ko) 반도체 디바이스들의 다중 직접 이송 방법 및 장치
JP7345585B2 (ja) 半導体製造装置および半導体装置の製造方法
JP3198401B2 (ja) ウェーハリングの供給・返送装置
JP3304295B2 (ja) ダイボンダ
US7192843B2 (en) Method of fabricating semiconductor device
JPS639374B2 (enrdf_load_stackoverflow)
KR100819792B1 (ko) 반도체 팩키지 제조용 테이프 커버 박리 장치 및, 테이프커버 박리 방법
JPH08227904A (ja) チップボンディング装置
CN115206864A (zh) 具有混合型顶出器的拾放系统
KR100533668B1 (ko) 기판처리장치
JP3870803B2 (ja) チップ部品供給装置
JP2005522046A (ja) 電気部品とくに半導体チップを処理するためのプロセス、およびこのプロセスを実行するための装置
JP2736637B2 (ja) チップボンディング方法
JPS6317249Y2 (enrdf_load_stackoverflow)
KR100427831B1 (ko) 가동판의 부착장치 및 부착방법
JP2003197715A (ja) リールテープへの半導体チップの貼付け装置
JPH10150093A (ja) ピックアップ装置
KR100914986B1 (ko) 칩 본딩 장비
US20020182759A1 (en) Semiconductor device manufacturing method and semiconductor device sorting system to be used with the same
CN216354255U (zh) 一种剥离装置及剥离系统
CN113784612B (zh) 一种自动贴片机
JPH01157549A (ja) ペレットのピックアップ方法