JPS6393691U - - Google Patents

Info

Publication number
JPS6393691U
JPS6393691U JP1986188644U JP18864486U JPS6393691U JP S6393691 U JPS6393691 U JP S6393691U JP 1986188644 U JP1986188644 U JP 1986188644U JP 18864486 U JP18864486 U JP 18864486U JP S6393691 U JPS6393691 U JP S6393691U
Authority
JP
Japan
Prior art keywords
conductor
insertion hole
electronic component
circuit board
insulating plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986188644U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986188644U priority Critical patent/JPS6393691U/ja
Publication of JPS6393691U publication Critical patent/JPS6393691U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1986188644U 1986-12-08 1986-12-08 Pending JPS6393691U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986188644U JPS6393691U (zh) 1986-12-08 1986-12-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986188644U JPS6393691U (zh) 1986-12-08 1986-12-08

Publications (1)

Publication Number Publication Date
JPS6393691U true JPS6393691U (zh) 1988-06-17

Family

ID=31140199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986188644U Pending JPS6393691U (zh) 1986-12-08 1986-12-08

Country Status (1)

Country Link
JP (1) JPS6393691U (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06220880A (ja) * 1993-01-28 1994-08-09 Komatsu Ltd 建設機械等用ブーム構造物
JP2019054017A (ja) * 2017-09-12 2019-04-04 アイシン精機株式会社 電子部品

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940760B1 (zh) * 1971-05-14 1974-11-05
JPS525703A (en) * 1976-06-25 1977-01-17 Rhone Poulenc Ind Method of producing primary alcohol
JPS52102678A (en) * 1976-02-25 1977-08-29 Nikkan Ind Heat conductive electric insulation sheet and method of manufacture thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940760B1 (zh) * 1971-05-14 1974-11-05
JPS52102678A (en) * 1976-02-25 1977-08-29 Nikkan Ind Heat conductive electric insulation sheet and method of manufacture thereof
JPS525703A (en) * 1976-06-25 1977-01-17 Rhone Poulenc Ind Method of producing primary alcohol

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06220880A (ja) * 1993-01-28 1994-08-09 Komatsu Ltd 建設機械等用ブーム構造物
JP2019054017A (ja) * 2017-09-12 2019-04-04 アイシン精機株式会社 電子部品

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