JPH02129796U - - Google Patents
Info
- Publication number
- JPH02129796U JPH02129796U JP3901189U JP3901189U JPH02129796U JP H02129796 U JPH02129796 U JP H02129796U JP 3901189 U JP3901189 U JP 3901189U JP 3901189 U JP3901189 U JP 3901189U JP H02129796 U JPH02129796 U JP H02129796U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- conductive foil
- insulating sheet
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011888 foil Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989039011U JPH0710557Y2 (ja) | 1989-03-31 | 1989-03-31 | プリント基板用雑音シールド装置 |
US07/488,831 US5119008A (en) | 1989-03-09 | 1990-03-06 | Battery charging apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989039011U JPH0710557Y2 (ja) | 1989-03-31 | 1989-03-31 | プリント基板用雑音シールド装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02129796U true JPH02129796U (zh) | 1990-10-25 |
JPH0710557Y2 JPH0710557Y2 (ja) | 1995-03-08 |
Family
ID=31547527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989039011U Expired - Lifetime JPH0710557Y2 (ja) | 1989-03-09 | 1989-03-31 | プリント基板用雑音シールド装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0710557Y2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003008276A (ja) * | 2001-06-21 | 2003-01-10 | Tamagawa Seiki Co Ltd | 光ファイバジャイロの駆動回路基板シールド方法及びシールド構造 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6170999U (zh) * | 1984-10-15 | 1986-05-15 | ||
JPS6226099U (zh) * | 1985-07-31 | 1987-02-17 |
-
1989
- 1989-03-31 JP JP1989039011U patent/JPH0710557Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6170999U (zh) * | 1984-10-15 | 1986-05-15 | ||
JPS6226099U (zh) * | 1985-07-31 | 1987-02-17 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003008276A (ja) * | 2001-06-21 | 2003-01-10 | Tamagawa Seiki Co Ltd | 光ファイバジャイロの駆動回路基板シールド方法及びシールド構造 |
JP4639277B2 (ja) * | 2001-06-21 | 2011-02-23 | 多摩川精機株式会社 | 光ファイバジャイロの駆動回路基板シールド方法及びシールド構造 |
Also Published As
Publication number | Publication date |
---|---|
JPH0710557Y2 (ja) | 1995-03-08 |