JPS6393641U - - Google Patents
Info
- Publication number
- JPS6393641U JPS6393641U JP18688586U JP18688586U JPS6393641U JP S6393641 U JPS6393641 U JP S6393641U JP 18688586 U JP18688586 U JP 18688586U JP 18688586 U JP18688586 U JP 18688586U JP S6393641 U JPS6393641 U JP S6393641U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- bending
- chips
- defective
- guides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002950 deficient Effects 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims 3
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18688586U JPS6393641U (enExample) | 1986-12-05 | 1986-12-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18688586U JPS6393641U (enExample) | 1986-12-05 | 1986-12-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6393641U true JPS6393641U (enExample) | 1988-06-17 |
Family
ID=31136852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18688586U Pending JPS6393641U (enExample) | 1986-12-05 | 1986-12-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6393641U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0465150A (ja) * | 1990-07-05 | 1992-03-02 | Ryoji Wakabayashi | 半導体ウエハーの保護膜剥離装置 |
| KR20010044604A (ko) * | 2001-03-09 | 2001-06-05 | 한효용 | 서킷테이프의 보호필름 제거장치 |
| JP2002252183A (ja) * | 2001-02-22 | 2002-09-06 | Nitto Denko Corp | 金属電極パターン形成方法 |
-
1986
- 1986-12-05 JP JP18688586U patent/JPS6393641U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0465150A (ja) * | 1990-07-05 | 1992-03-02 | Ryoji Wakabayashi | 半導体ウエハーの保護膜剥離装置 |
| JP2002252183A (ja) * | 2001-02-22 | 2002-09-06 | Nitto Denko Corp | 金属電極パターン形成方法 |
| KR20010044604A (ko) * | 2001-03-09 | 2001-06-05 | 한효용 | 서킷테이프의 보호필름 제거장치 |
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