JPS6390883U - - Google Patents
Info
- Publication number
- JPS6390883U JPS6390883U JP18646686U JP18646686U JPS6390883U JP S6390883 U JPS6390883 U JP S6390883U JP 18646686 U JP18646686 U JP 18646686U JP 18646686 U JP18646686 U JP 18646686U JP S6390883 U JPS6390883 U JP S6390883U
- Authority
- JP
- Japan
- Prior art keywords
- cover
- protrusion
- circuit pattern
- molded
- resin material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
- 239000006247 magnetic powder Substances 0.000 claims 1
- 239000000047 product Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000013067 intermediate product Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の電気実装に適用する電気回路
の１例のブロツク図、第２図は本考案の電気実装
の実施例を示す実装構成図、第３図Ａ・Ｂ・Ｃ・
Ｄ・Ｅは第２図の実装を構成する成形品１の成形
説明図。
１…電気機器のボデイ・カバー、又は中間品を
樹脂成形した成形品、１Ａ…前記成形品の内面に
設けた回路パターン、４Ａ・４Ｂ…金型の型板、
４ａ１・４ｂ１…型板の磁性部、６…マスク部材
。
Figure 1 is a block diagram of an example of an electric circuit applied to the electrical packaging of the present invention, Figure 2 is a mounting configuration diagram showing an example of the electrical packaging of the present invention, and Figure 3 is A, B, C,
D and E are explanatory views of the molded product 1 constituting the mounting shown in FIG. 2. 1...Body cover of electrical equipment or a molded product obtained by resin molding an intermediate product, 1A...Circuit pattern provided on the inner surface of the molded product, 4A/4B...Mold template,
4a 1 , 4b 1 ...Magnetic part of the template, 6...Mask member.
Claims (1)
あるいは樹脂材料で成形し前記ボデイ、カバーに
取り付けた中間体の内面に突部を設けて樹脂材料
で成形し、前記突部表面に磁性粉を含有した回路
パターンを前記ボデイやカバー又は中間体の成形
時に同一金型によつて一体成形し、前記突部表面
上の前記回路パターンを前記ボデイやカバー又は
中間体に固定した回路基板の回路パターンに電気
接続したことを特徴とする電気機器の電気実装。 A protrusion is provided on the inner surface of the body or cover of an electrical device including an electric circuit, or an intermediate body molded from a resin material and attached to the body or cover, and is molded from a resin material, and the surface of the protrusion contains magnetic powder. The circuit pattern is integrally molded using the same mold during molding of the body, cover, or intermediate body, and the circuit pattern on the surface of the protrusion is electrically applied to the circuit pattern of the circuit board fixed to the body, cover, or intermediate body. Electrical implementation of electrical equipment characterized by connected.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18646686U JPS6390883U (en) | 1986-12-03 | 1986-12-03 | |
| US07/408,942 US4935174A (en) | 1986-01-13 | 1989-09-18 | Resin molded article bearing electric circuit patterns and process for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18646686U JPS6390883U (en) | 1986-12-03 | 1986-12-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6390883U true JPS6390883U (en) | 1988-06-13 |
Family
ID=31136050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18646686U Pending JPS6390883U (en) | 1986-01-13 | 1986-12-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6390883U (en) |
-
1986
- 1986-12-03 JP JP18646686U patent/JPS6390883U/ja active Pending