JPS6390853U - - Google Patents

Info

Publication number
JPS6390853U
JPS6390853U JP1986186172U JP18617286U JPS6390853U JP S6390853 U JPS6390853 U JP S6390853U JP 1986186172 U JP1986186172 U JP 1986186172U JP 18617286 U JP18617286 U JP 18617286U JP S6390853 U JPS6390853 U JP S6390853U
Authority
JP
Japan
Prior art keywords
duct
semiconductor
conversion device
cooling
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986186172U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0541560Y2 (US20030204162A1-20031030-M00001.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986186172U priority Critical patent/JPH0541560Y2/ja
Priority to US07/127,393 priority patent/US4901138A/en
Publication of JPS6390853U publication Critical patent/JPS6390853U/ja
Application granted granted Critical
Publication of JPH0541560Y2 publication Critical patent/JPH0541560Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Details Of Resistors (AREA)
  • Power Conversion In General (AREA)
  • Rectifiers (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1986186172U 1986-12-04 1986-12-04 Expired - Lifetime JPH0541560Y2 (US20030204162A1-20031030-M00001.png)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1986186172U JPH0541560Y2 (US20030204162A1-20031030-M00001.png) 1986-12-04 1986-12-04
US07/127,393 US4901138A (en) 1986-12-04 1987-12-02 Semiconductor converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986186172U JPH0541560Y2 (US20030204162A1-20031030-M00001.png) 1986-12-04 1986-12-04

Publications (2)

Publication Number Publication Date
JPS6390853U true JPS6390853U (US20030204162A1-20031030-M00001.png) 1988-06-13
JPH0541560Y2 JPH0541560Y2 (US20030204162A1-20031030-M00001.png) 1993-10-20

Family

ID=16183650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986186172U Expired - Lifetime JPH0541560Y2 (US20030204162A1-20031030-M00001.png) 1986-12-04 1986-12-04

Country Status (2)

Country Link
US (1) US4901138A (US20030204162A1-20031030-M00001.png)
JP (1) JPH0541560Y2 (US20030204162A1-20031030-M00001.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010016959A (ja) * 2008-07-02 2010-01-21 Toshiba Mitsubishi-Electric Industrial System Corp 風冷式電力変換装置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE9304264L (sv) * 1993-12-22 1995-06-23 Ericsson Telefon Ab L M Förfarande och anordning för kylning i slutna rum
JPH07202464A (ja) * 1993-12-28 1995-08-04 Toshiba Corp 電子機器装置並びに電子機器装置用冷却方法及びファン装置
GB9408043D0 (en) * 1994-04-22 1994-06-15 At & T Global Inf Solution Structure for cooling an equipment enclosure
US6158454A (en) * 1998-04-14 2000-12-12 Insync Systems, Inc. Sieve like structure for fluid flow through structural arrangement
GB9924903D0 (en) * 1999-10-22 1999-12-22 Eaton Ltd Cooling resistor banks
US6459579B1 (en) * 2001-01-03 2002-10-01 Juniper Networks, Inc. Apparatus and method for directing airflow in three dimensions to cool system components
US6541942B1 (en) * 2001-11-13 2003-04-01 Aerovironment, Inc. Capacitor tub assembly and method of cooling
GB0207382D0 (en) 2002-03-28 2002-05-08 Holland Heating Uk Ltd Computer cabinet
TWI260484B (en) * 2003-08-12 2006-08-21 Asustek Comp Inc Heat sink for power device on computer motherboard
DE202006006441U1 (de) * 2006-04-21 2006-07-06 Knürr AG Anordnung zum Kühlen von elektrischen Baugruppen und Geräten
JP5348623B2 (ja) * 2010-09-10 2013-11-20 株式会社安川電機 電子機器装置
US20190115284A1 (en) * 2017-10-16 2019-04-18 David Herbert Livingston Cooling device and method for heat-generating components

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59177997A (ja) * 1983-03-28 1984-10-08 日本電気株式会社 電子装置の冷却構造
JPS608475A (ja) * 1983-06-20 1985-01-17 ルシオ・ブイ・リ−ル 発電装置
JPH06210444A (ja) * 1993-01-14 1994-08-02 Kuroda Denki Kk 液体雰囲気を利用したはんだ付方法
JPH06273593A (ja) * 1993-03-22 1994-09-30 Hiroyuki Matsuda 物質を等価的にタキオン化する方法
JP2847605B2 (ja) * 1993-03-23 1999-01-20 住友重機械工業株式会社 低速陽電子ビーム発生装置
JPH06273592A (ja) * 1993-03-24 1994-09-30 Ishikawajima Harima Heavy Ind Co Ltd 地層シュミレーション装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010016959A (ja) * 2008-07-02 2010-01-21 Toshiba Mitsubishi-Electric Industrial System Corp 風冷式電力変換装置

Also Published As

Publication number Publication date
JPH0541560Y2 (US20030204162A1-20031030-M00001.png) 1993-10-20
US4901138A (en) 1990-02-13

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